Suzhou Dongwei Semiconductor Co., Ltd
Initial public offering and listing on the science and Innovation Board
Online roadshow announcement
Sponsor (lead underwriter): China International Capital Corporation Limited(601995)
The application of Suzhou Dongwei Semiconductor Co., Ltd. (hereinafter referred to as "the issuer" or "the company") for initial public offering of RMB common shares (A shares) and listing on the science and Innovation Board (hereinafter referred to as "the offering") was examined and approved by the members of the stock listing committee of the science and Innovation Board of Shanghai Stock Exchange on November 4, 2021, It was approved and registered by China Securities Regulatory Commission on December 21, 2021 (zjxk [2021] No. 4040).
This issuance is conducted by a combination of directional placement to strategic investors (hereinafter referred to as "strategic placement"), offline inquiry placement to qualified investors (hereinafter referred to as "offline issuance") and online pricing issuance to social public investors holding the market value of non restricted A-Shares and non restricted depositary receipts in Shanghai market (hereinafter referred to as "online issuance").
China International Capital Corporation Limited(601995) (hereinafter referred to as " China International Capital Corporation Limited(601995) " or "sponsor (lead underwriter)") serves as the sponsor (lead underwriter) of this offering.
The issuer and the recommendation institution (lead underwriter) will directly determine the issuance price through offline preliminary inquiry, and offline cumulative bidding inquiry will not be conducted. The initial number of shares issued this time is 1684409200 shares, accounting for 25.00% of the total share capital of the issuer after the issuance. All of them are new shares issued to the public, and the shareholders of the company do not offer shares to the public. The initial number of strategic placements issued in this issuance is 2526613 shares, accounting for 15.00% of the issued number. The difference between the final number of strategic placements and the initial number of strategic placements will be first transferred back to offline issuance. Before the launch of the callback mechanism, the initial number of shares issued offline was 10.02479 million, accounting for 70.00% of the number issued after deducting the initial strategic placement; Before the launch of the callback mechanism, the initial number of shares issued online was 4.295 million, accounting for 30.00% of the number issued after deducting the initial strategic placement.
The total quantity of final offline and online issuance is the total quantity of this issuance minus the final strategic placement quantity. The final online and offline issuance quantity will be determined according to the callback situation.
In order to facilitate investors to understand the relevant information of the issuer and the relevant arrangements of this offering, the issuer and the sponsor (lead underwriter) of this offering will hold an online roadshow on this offering. Please pay attention to it. 1. Online roadshow time: 14:00-17:00 on January 21, 2022 (t-1);
2. Online roadshow website:
Shanghai Securities roadshow Center: http://roadshow.sseinfo.com.
China Securities Network: http://roadshow.cn.stock.com.
3. Participants: the chairman of the board of directors and key members of the management of the issuer and relevant personnel of the recommendation institution (lead underwriter).
The full text of the letter of intent of Suzhou Dongwei Semiconductor Co., Ltd. for initial public offering and listing on the science and innovation board and relevant materials can be found on the website of Shanghai Stock Exchange (www.sse. Com. CN) Query.
Please pay attention to it.
Issuer: sponsor (lead underwriter) of Suzhou Dongwei Semiconductor Co., Ltd.: China International Capital Corporation Limited(601995) January 20, 2022 (there is no text on this page, which is the sealed page of online roadshow announcement of Suzhou Dongwei Semiconductor Co., Ltd. on initial public offering and listing on science and Innovation Board)
Issuer: Suzhou Dongwei Semiconductor Co., Ltd. (this page has no text and is the sealed page of online roadshow announcement of Suzhou Dongwei Semiconductor Co., Ltd. on initial public offering and listing on science and Innovation Board)
Sponsor (lead underwriter): China International Capital Corporation Limited(601995) mm / DD / yy
