Zhongtai Securities Co.Ltd(600918)
about
Guangdong Kingshine Electronic Technology Co.Ltd(300903)
Issue shares to specific objects
of
Listing recommendation
(No. 86, Jingqi Road, Jinan City, Shandong Province)
April 2002
statement
Zhongtai Securities Co.Ltd(600918) (hereinafter referred to as ” Zhongtai Securities Co.Ltd(600918) ,” sponsor “or” sponsor “) accepts the entrustment of Guangdong Kingshine Electronic Technology Co.Ltd(300903) (hereinafter referred to as” Guangdong Kingshine Electronic Technology Co.Ltd(300903) , “company” or “issuer”) to act as the listing sponsor of its stock issuance to specific objects.
Zhongtai Securities Co.Ltd(600918) and its sponsor representatives have, in accordance with the company law of the people’s Republic of China (hereinafter referred to as the “company law”), the securities law of the people’s Republic of China (hereinafter referred to as the “Securities Law”) and the measures for the administration of securities issuance and listing recommendation business The measures for the administration of securities issuance and registration of companies listed on the gem (for Trial Implementation) (hereinafter referred to as the “measures for the administration of registration”) and the rules for the examination and approval of securities issuance and listing of companies listed on the gem of Shenzhen Stock Exchange and other laws and regulations, as well as the relevant provisions of the CSRC and Shenzhen Stock Exchange, are honest, trustworthy, diligent and responsible, and issue the listing recommendation letter in strict accordance with the business rules and industry self-discipline norms formulated according to law, And ensure that the documents issued are true, accurate and complete.
All abbreviations and definitions in this document, unless otherwise specified, are consistent with the due diligence report of Zhongtai Securities Co.Ltd(600918) on Guangdong Kingshine Electronic Technology Co.Ltd(300903) issuing shares to specific objects.
1、 Issuer profile
(I) basic information
Chinese Name: Guangdong Kingshine Electronic Technology Co.Ltd(300903)
English Name: Guangdong kingshine Electronic Technology Co., Ltd
Stock Exchange: Shenzhen Stock Exchange
Stock abbreviation: Guangdong Kingshine Electronic Technology Co.Ltd(300903)
Stock Code: Guangdong Kingshine Electronic Technology Co.Ltd(300903)
Date of establishment: November 2, 2001
Registered capital: 172337694 yuan
Legal representative: Zheng Xiaorong
Secretary of the board of directors: Zheng Haitao
Registered address: No. 9, Longshan 8th Road, Dayawan West District, Huizhou City, Guangdong Province
Business scope: manufacturing and selling new electronic components. The proportion of domestic and foreign sales of products shall be determined by the company according to the market demand. Processing and sales of semi-finished printed circuit boards, product trade, product research and development, technical testing and technical consulting services. (for projects subject to approval according to law, business activities can be carried out only after approval by relevant departments)
Postal Code: 516083
Internet address: http://www.gdkxpcb.com./
Tel.: 07525181019
Contact Fax: 07525181019
(II) share capital structure of the issuer
As of March 31, 2022, the total share capital of the company is 172337694 shares, and the shareholding of the top ten shareholders of the company is as follows:
Sequence shareholder name shareholder nature shareholding quantity shareholding proportion restricted shares number (share) (%) (share)
1 natural person in Zheng Xiaorong 3416968419.8334169684
2. Natural person in Tan Dong 2646060015.3526460600
3 Shenzhen Kexiang capital management domestic non state owned law 102203415.9310220341 Management Co., Ltd
4 natural persons in Xinhua 86168065.00-
Zhuhai Hengqin Kexiang Fufa domestic non state owned law
5 electronic partnership (limited person Shanghai Pudong Development Bank Co.Ltd(600000) 03.48 – partnership)
Non state owned law of Gongqingcheng Yintai Jiayi Investment Co., Ltd
6. Capital management partnership (with 5515000 persons 3.20 – limited partnership)
Zhuhai Hengqin Kexiang Fuhong domestic non state owned law
7 electronic partnership (limited person 50 China Vanke Co.Ltd(000002) .905000000 partnership)
Zhuhai Hengqin Kexiang Fuchang non state owned law
8 electronic partnership (limited person 50 China Vanke Co.Ltd(000002) .90 – partnership)
9 Chen Huanxian domestic natural person 39105662.273910549
Zhuhai shenzhihua phase I domestic non state owned law
10 investment center (limited partner 30989841.80 – partner)
Total 10799198162.6679761174
The controlling shareholders and actual controllers of the company are Zheng Xiaorong and Tan Dong, and they are husband and wife. As of March 31, 2022, Ms. Zheng Xiaorong directly held 341697 million shares of the company, with a shareholding ratio of 19.83%; Mr. Tan Dong directly holds 264606 million shares of the company, with a shareholding ratio of 15.35%.
(III) main business of the issuer
The company is a high-tech enterprise engaged in R & D, production and sales of high-density printed circuit boards. At present, the company has put into operation four PCB production bases with an annual PCB production capacity of more than 2.4 million square meters. It can provide PCB products such as double-layer board, multi-layer board, high-density interconnect (HDI) board, thick copper board, high-frequency / high-speed board, metal substrate, IC carrier board, soft and hard combination board in one stop. The product terminals are used in consumer electronics, communication equipment, industrial control, automotive electronics, computers and other fields.
Printed circuit board mainly provides mechanical support, wiring and electrical connection for fixed assembly of electronic components in electronic information products, and carries the functions of signal transmission, power supply and so on. The company’s printed circuit board products are positioned in the medium and high-end market and provide customized PCB products for mainstream customers in various segments of electronic information manufacturing industry.
1. Double layer and multilayer boards
Double layer board and multilayer board are the most common printed circuit boards. The company’s double-layer board is mainly used in the field of consumer electronics; Multilayer board is mainly composed of four, six and eight layers. It is widely used in consumer electronics, communication equipment, automotive electronics, computers and other fields. The minimum aperture of double-layer board and multi-layer board produced by the company can reach 0.15mm, the minimum line width / line distance can reach 0.05/0.05mm, the maximum number of layers can reach 32, and the maximum aspect ratio can reach 12:1.
2. HDI board
HDI board, namely high density interconnect printed circuit board, has the characteristics of high density, fine wire, small aperture and so on. The company is one of the few companies in China with any layer HDI mass production capacity. At present, HDI boards are mainly 6-10 layers and 1-3 levels, which are widely used in consumer electronics, industrial control, automotive electronics and other fields. The minimum aperture of HDI board produced by the company can reach 0.075mm, the minimum line width / line distance can reach 0.05/0.05mm, and the maximum number of layers of interconnection HDI board in any layer can reach 10.
3. Special board
Special board generally refers to the printed circuit board customized according to the special purpose of the downstream and made of special materials or special processes, which is difficult to produce. The main products of the company’s special sectors include thick copper sectors, high-frequency / high-speed sectors, metal substrates, IC carrier sectors, soft and hard bonding sectors, etc.
Thick copper sector can carry large current and high voltage, and has high heat dissipation performance. The thick copper sector produced by the company is mainly used in photovoltaic inverter, power control equipment, etc; High frequency / high-speed board has fast signal transmission speed and high integrity. It is mainly used in communication equipment for high-frequency signal transmission or high-speed logic signal transmission; Metal substrates generally have good thermal conductivity and machinability. The metal substrates produced by the company are mainly aluminum substrates, which are mainly used in automobile lamps with large heat generation; IC carrier board is a high-end PCB product developed on the basis of HDI board. With the technical accumulation of long-term R & D and production of high-density printed circuit board, the company has been able to produce some IC carrier boards with ordinary Density specifications in small quantities, including MEMS packaging substrate and storage chip packaging substrate, which are mainly used in sensors and memories of small electronic equipment.
Soft and hard bonding board, also known as “rigid and flexible bonding board”, is a new product developed and approved by the company in 2019 and entered small batch trial production in 2020. It is a printed board made of thin flexible substrate materials that can be bent, combined with rigid substrates in different areas and connected with metal holes to form an interconnected structure. They can be bent into a three-dimensional (3D) structure, with the characteristics of light, thin, short, small and flexible installation. At present, the company has 2-30 layers of rigid flexible composite sector samples and batch production capacity, covering multi-layer bonding structure, multi-layer paging structure, step structure, HDI structure, high-frequency and high-speed hybrid structure and other forms. The minimum line width spacing is 65um and the minimum aperture is 0.15mm. The products are widely used in military and aerospace, automotive electronics, medical electronics and other fields.
(IV) core technology and R & D of the issuer
1. Core technology of the issuer
In the long-term production and operation process, the company has independently developed a number of patented and non patented technologies. These technologies are the key core technologies and common technologies of the company in terms of process and process capability. They play a role in reducing manufacturing costs, improving product yield, optimizing production processes and process technical parameters, enriching product structure, etc, It can better meet customers’ needs for PCB product quality improvement and other aspects. The main information of core technology is listed as follows:
S / n technology name key technology and functional features application achievement transformation stage
Through the research on the processing method of fine line, the new fine line is formed according to the research
1 processing method, optimize the process parameters of etching equipment, and develop a new process mass production non patented technical process to meet the etching requirements of line width and line spacing of 2 / 2mil and below.
Through the research of metallized hole, the drilling accuracy and drilling accuracy are ensured in the process of depth control drilling
2. While controlling the depth of the driller, the alkaline etching process is added to etch the burr and burr of mass production non patented technology in the depth control drilling, so as to meet the technology and quality of depth control drilling
requirement.
The CO2 laser blind hole diameter is increased by adjusting the parameters of the laser machine and the drilling method
3-hole reaming technology is large, and the blind hole is electrosectord by special electroplating method, so that the blind hole is convenient for mass production, conduction and heat dissipation of non patented technology.
Hole filling depression through the use of dry film point plating method, the utility model patent is carried out at the position of single point blind hole: 4 technology filling plating, which not only ensures the good filling and plating of blind hole, but also ensures the uniform mass production of surface copper, and the electrical property and thickness of a PCB thin sector. Plated fixed frame
In order to ensure 0.2mm micro drilling, the type of drilling tool and precision of drilling machine
5 micro drilling technology, drilling accessories, drilling parameters and electrosectord black hole line adopt special mass production and non patented technology processing methods to ensure the quality of hole wall.
Research on the negative film of half hole sector making metallized half hole PCB through the negative film process, while ensuring the high-tech product certification: 6 the processing process can shorten the half hole quality, reduce the process cost, mass produce metallized half hole printing force, improve the technology and improve the production efficiency. Circuit board
After the introduction of pulse rectifier into printed circuit board, the aspect ratio is greater than 12:1
7 through hole electroplating can set the current parameters of PCB, master the parameters of pulse electroplating, the reliability of non patented technology and maintenance details, and complete the technical storage of electroplating high reliability hole copper
Serial number technology name key technology and functional features application achievement transformation
