Citic Securities Company Limited(600030)
about
Listing recommendation letter of Shenyang fuchuang precision equipment Co., Ltd. for initial public offering and listing on the science and Innovation Board
(North block of excellence Times Square (phase II), No. 8, Zhongxin Third Road, Futian District, Shenzhen, Guangdong)
April, 2002
catalogue
catalogue 2 declare that Section 1 basic information of the issuer 4 I. Basic information of the issuer 4 II. The issuer’s main business 4 III. core technology of the issuer 5 IV. R & D level of the issuer 7 v. main business and financial data and indicators Vi. main risks of the issuer 8 section 2 the issuance of Securities 15 I. Basic information of this securities issuance 15 II. Information of project sponsor representative, CO sponsor and other members of the project team 15 III. relationship between the sponsor and the issuer 16 IV. sponsor’s internal audit procedures and core opinions Section III commitments of the sponsor Section IV recommendation opinions of the sponsor on the issuance and listing of Securities 20 I. recommendation opinions 20 II. This issuance has fulfilled the necessary decision-making procedures 20 III. The issuer complies with the positioning of science and Technology Innovation Board 21 IV. The issuer meets the listing conditions specified in the Listing Rules of Shanghai Stock Exchange on the science and innovation board.22 section 5 post listing continuous supervision work arrangement twenty-seven
Statement
Citic Securities Company Limited(600030) and its recommendation representatives have been honest, trustworthy, diligent and responsible in accordance with the company law of the people’s Republic of China, the securities law of the people’s Republic of China and other laws and regulations and the relevant provisions of the CSRC and Shanghai Stock Exchange, issued the listing recommendation letter in strict accordance with the business rules and industry self-discipline norms formulated according to law, and guaranteed that the documents issued are true, accurate and complete.
Unless otherwise specified, the abbreviation in this listing recommendation letter has the same meaning as the abbreviation in the prospectus.
Section 1 basic information of the issuer
1、 Basic information of the issuer
Company name: Shenyang fuchuang precision equipment Co., Ltd
English Name: Shenyang fortune precision equipment Co., Ltd
Registered capital: 156.79 million yuan
Legal representative: Zheng Guangwen
Date of establishment of the company: June 24, 2008
Date of establishment of the joint stock company: October 27, 2020
Address: No. 18a-1, Feiyun Road, Hunnan District, Shenyang, Liaoning
Postal Code: 110168
Tel: 02431692129
Fax No.: 02431692129
Internet address: http://www.fortune-semi.com.
Email: [email protected].
Information disclosure and investor relations management department: Securities Department
Person in charge of information disclosure and contact number: Xu Dan, 02431692129 II. Main business of the issuer
The company is a leading enterprise in precision parts of semiconductor equipment in China and one of the few precision parts manufacturers in the world that can mass produce semiconductor equipment used in 7-nanometer process. Focusing on the precision manufacturing technology of metal parts and components, the company has mastered a variety of manufacturing processes that can meet stringent standards, such as precision machinery manufacturing, special surface treatment processes, welding, assembly, testing and so on. Through batch supply to leading semiconductor equipment enterprises at home and abroad, the company has established a series of manufacturing standard processes and quality management systems to ensure the high precision, high cleanliness, high corrosion resistance The breakdown voltage resistance and other properties meet the mainstream international customer standards. In addition to the semiconductor equipment for manufacturing integrated circuit products, the company’s products are also used in the manufacturing of display panels, pan semiconductor equipment for photovoltaic products and other fields. The company’s products include process parts, structural parts, module products and gas pipelines. 3、 Issuer’s core technology
Through self research and undertaking the national “02 major projects”, the company has formed strong technical capabilities in the fields of precision machinery manufacturing, surface treatment, special processes and welding. The source of the company’s core technology and the first step are as follows:
(I) precision machinery manufacturing technology
The core technology mainly applies the specific characterization of relevant patent technology sources
Name product protection
① Large size cavity processing: the most Machinable process parts, the cavity length of the large transmission platform can reach the transition cavity and meter in 3.23
High precision multiplex transmission cavity and 17 special applications for reaction ② multi station one-stop processing: it can realize the cavity with complex profile cavity, which is applied to the continuous processing and manufacturing technology of more than 700 size stations on the self-developed body, etching equipment and thin finish
Film deposition equipment ③ high precision: it can ensure the precise fit of linear size with other parts and components, and ensure the high tightness of the equipment
① Micro hole diameter processing: the minimum hole diameter of process parts can be processed is 0.3mm
Homogenizing disk in high-precision micropores ② high precision: the hole manufacturing technology of thousands of micropores is applied to engrave and apply for a patent. The diameter dimension tolerance can be controlled within ± a few microns. Internal etching equipment and film ③ high efficiency: the company designs tools jointly with tool supply and deposition equipment, And independently configure cutting fluid to improve manufacturing efficiency
① Independently design forming tools to realize high finish fine hole processing, so that the inner holes of each channel and stainless steel ultra-high process gas sealing surface can meet the performance requirements of 13 independent research and development applications for high hardness and roughness finish manufacturing and flow control at the same time
The stainless steel metal mirror polishing technology can realize high-quality and high-efficiency special-shaped station mirror polishing, and the mirror surface roughness can meet the mainstream international customer standards
(II) special surface treatment technology
The core technology mainly applies the specific characterization of the source of relevant patent protection technology
Name product
In terms of cleanliness of corrosion-resistant anode process parts ①, after surface treatment, reaction chamber in special oxidation technology, LPC liquid lining on the product surface after applying for 20 patents and self-developed processes, particle detection and ICP metal element detection have reached
According to the standards of etching equipment and mainstream international customers, the products after anodic film deposition and polar oxidation of the company can pass the rigorous fluorescent preparation and other light tests (there are no visible fluorescent particles on the surface of process parts under UV detection)
In terms of lining and transmission ② ultra-high vacuum, the company’s products have high vacuum cleanliness, fine conveying chamber and uniformity, which meet the mainstream international customer standards
The dense cleaning technology disk is applied to the independent research and development of one patent. ③ in terms of corrosion resistance, the products after surface treatment, special corrosion equipment and film process can achieve no bubble generation in hydrochloric acid immersion deposition equipment for several hours, and the film will not corrode in acid salt fog environment for dozens of days, Process parts exceed the mainstream international customer standards
Transmission cavity in high performance chemistry
Nickel plating technology, etc., applied to engraving, applied for 13 patents and independently developed
Etching equipment and film
Deposition equipment, etc
Plasma spraying process parts
The lining in yttria coating has applied for 21 patents and independently developed
Technology is mainly used in
Etching equipment
(III) welding technology
The core technology mainly applies the specific characterization of the source of relevant patent protection technology
Name product
① Realize welding in vacuum environment and ensure welding quality and process controllability
Homogenizing disk, cooling ② welding energy is concentrated, heat affected zone is small, sector and gas pipeline improve the dimensional accuracy of parts after welding and reduce mechanical electron beam welding. Semiconductor equipment has applied for 16 patents and independently developed and manufactured machinery
③ the welding consistency of precision parts prepared by technology is good, and the penetration accuracy of weld bead can be controlled within ± 0.2mm.
The welding depth can reach 0.3mm-90mm, which is applied to the welding of precision parts such as homogenizing sector and heating sector
Cavity bushing and exciter ① have stable welding quality, effective light welding cooling clothing, poor laser absorption efficiency of aluminum alloy materials, laser welding technology board and other semiconductors have applied for 18 patents, and are easy to develop independently
Technology equipment precision zero ② solve semiconductor grade aluminum alloy laser self parts
