Company code: 688270 company abbreviation: Zhenlei technology Zhejiang Zhenlei Technology Co., Ltd
Annual report for 2021
Important tips
1、 The board of directors, board of supervisors, directors, supervisors and senior managers of the company guarantee the authenticity, accuracy and integrity of the contents of the annual report, and there are no false records, misleading statements or major omissions, and bear individual and joint legal liabilities. 2、 Unprofitable and unprofitable when the company is listed □ yes √ no III. tips on major risks
During the reporting period, there were no particularly significant risks that had a material impact on the company's production and operation. The company has described the possible risks in detail in the report. Please refer to "section III Management Discussion and analysis: IV. risk factors". 4、 All directors of the company attended the board meeting. 5、 Tianjian Certified Public Accountants (special general partnership) issued a standard unqualified audit report for the company. 6、 Zhang Bing, the person in charge of the company, Li Na, the person in charge of accounting, and Li Na, the person in charge of the accounting organization (Accounting Supervisor), declare that they guarantee the authenticity, accuracy and completeness of the financial report in the annual report. 7、 The profit distribution plan or the plan of converting accumulation fund into share capital in the reporting period adopted by the resolution of the board of directors
In order to repay investors, the company plans to distribute a cash dividend of 2.77 yuan (including tax) to all shareholders for every 10 shares based on the total share capital registered on the date of equity distribution. As of March 31, 2022, the total share capital of the company is 109210000 shares. Based on this calculation, the total cash dividend to be distributed is 3025117000 yuan (including tax), accounting for 30.60% of the net profit attributable to the shareholders of the listed company in the consolidated statements. The company does not convert capital reserve into share capital and does not give bonus shares. If the total share capital of the company changes before the equity registration date of equity distribution, the company plans to keep the total distribution unchanged and adjust the distribution proportion per share accordingly.
The profit distribution plan of the company in 2021 has been deliberated and approved at the 7th Meeting of the first board of directors of the company, which needs to be implemented after deliberated and approved by the 2021 annual general meeting of shareholders of the company. 8、 Whether there are important matters such as special arrangements for corporate governance □ applicable √ not applicable IX. risk statement of forward-looking statements √ applicable □ not applicable
The future plans, development strategies and other forward-looking descriptions involved in this report do not constitute the company's substantive commitment to investors. Please pay attention to investment risks.
10、 Whether there is any non operational occupation of funds by the controlling shareholders and their related parties no Xi. Whether there is any external guarantee in violation of the specified decision-making procedures no XII. Whether more than half of the directors cannot guarantee the authenticity, accuracy and completeness of the annual report disclosed by the company no XIII. Others □ applicable √ not applicable
catalogue
Section 1 interpretation Section 2 company profile and main financial indicators Section III Management Discussion and Analysis Section IV corporate governance Section V environment, social responsibility and other corporate governance Section VI important matters Section VII changes in shares and shareholders 81 Section VIII preferred shares 87 section 9 relevant information of corporate bonds 88 section x financial report eighty-eight
Financial statements containing the signatures and seals of the person in charge of the company, the person in charge of accounting work and the person in charge of accounting organization (the person in charge of the catalogue of documents for future reference).
The original of the audit report with the seal of the accounting firm and the signature and seal of the certified public accountant.
Originals of all company documents and announcements publicly disclosed during the reporting period.
Section I interpretation
1、 In this report, unless the context otherwise requires, the following words and expressions have the following meanings: common words and expressions mean the company, the company, the parent company, Zhejiang Zhenlei Technology Co., Ltd., Zhenlei technology and Zhenlei technology company
Chengxin technology and Chengxin company refer to Hangzhou Chengxin Technology Co., Ltd., a wholly-owned subsidiary of the issuer
Hangxinyuan and hangxinyuan company refer to Zhejiang hangxinyuan integrated circuit technology Co., Ltd., a wholly-owned subsidiary of the issuer
Jimec and jimec refer to Zhejiang jimec Microelectronics Co., Ltd
Yuhuang investment and Yuhuang investment company refer to Hangzhou Yuhuang Investment Management Co., Ltd
department
The articles of association refers to the articles of association of Zhejiang Zhenlei Technology Co., Ltd
Company Law refers to the company law of the people's Republic of China
Securities Law refers to the securities law of the people's Republic of China
The reporting period refers to January December 2021
Yuan and 10000 yuan refer to RMB yuan and 10000 yuan
Chip, integrated circuit and IC refer to the integrated circuit, which is a kind of micro electronic device or component. The required electronic components such as transistors, resistors, capacitors and inductors are connected according to the requirements by using the corresponding process, and made on the same wafer substrate to realize the electrical circuit of specific functions. IC is the English abbreviation of integrated circuit, and chip is the common name of integrated circuit
Wafer Factory refers to the wafer foundry, which refers to the enterprise specially responsible for chip manufacturing
Wafer refers to circular silicon or compound crystal semiconductor materials, also known as wafers, wafers and wafers, used to manufacture integrated circuits
Sealing and testing refers to the abbreviation of "packaging and testing"; "Packaging" refers to the installation of the shell for the chip to realize the functions of fixing, sealing, heat conduction, shielding and protecting the chip; "Test" refers to testing whether the function and performance indexes of the encapsulated chip meet the requirements
Mask, also known as mask, photomask or reticle, is a mold for producing wafers (wafers).
The mask is produced according to the integrated circuit layout designed by the chip design company. A set of mask usually has several to dozens of layers according to the complexity of the chip. The wafer manufacturer produces the wafer according to the mask
In order to verify whether the integrated circuit design is successful, it must be streamed, that is, from a circuit diagram to a chip, to check whether each process step is feasible and whether the circuit has the required function and performance. If the chip is successfully streamed, the chip can be manufactured on a large scale; On the contrary, it is necessary to locate the cause and carry out corresponding optimization design - the above process is generally referred to as engineering trial flow. Mass production after the success of engineering trial production is called mass production
Column equipment refers to a kind of equipment that is included in the equipment sequence of the army and equipped in batches after being designed and finalized
Phased array radar refers to a radar that uses electronic technology to control the phase of each radiation unit of the array antenna to make the antenna beam point to the rapidly changing radar in space. It is characterized by large target capacity and high data rate, and can monitor and track multiple targets at the same time; It has the functions of search, identification, tracking, guidance and so on; It has strong adaptability to complex target environment, good anti-interference performance and high reliability
Digital phased array refers to a phased array system that uses digital algorithms to realize beamforming or simultaneous multi beam
Analog chip refers to an integrated circuit that processes continuous analog signals. In a narrow sense, the internal circuit of analog chip is completely composed of the basic modules of analog circuit; Generalized analog chip also includes digital analog mixed signal chip and RF front-end chip
Digital analog hybrid chip refers to an integrated circuit that combines the functions of analog circuit and digital circuit. It includes both the basic voltage source module and the analog circuit module, including the voltage source module, the current source module, the comparator module, and so on
Microwave refers to the electromagnetic wave with the frequency range of 300MHz ~ 300GHZ. It is the abbreviation of a limited frequency band in radio wave, that is, the electromagnetic wave with the wavelength between 1mm ~ 1m. According to the frequency from low to high, it includes: L-band (1 ~ 2GHz), S-band (2 ~ 4GHz), C-band (4 ~ 8GHz), X-band (8 ~ 12GHz), Ku band (12 ~ 18GHz), K-band (18 ~ 26.5ghz), Ka band (26.5 ~ 40GHz), Q-band (30 ~ 50GHz), etc
Millimeter wave refers to a kind of high-frequency electromagnetic wave in microwave, with frequency range of 30ghz ~ 300GHZ and wavelength of 1mm ~ 10mm
Radio frequency and RF refer to radio frequency, or RF for short, which is a kind of electromagnetic wave with high-frequency AC change, and the frequency range is between 300kHz and 300GHZ
Terminal RF front-end chip refers to the electronic components that convert the radio signal into a certain radio signal waveform and send it through antenna resonance. It has the function of processing high-frequency continuous small signals, including antenna switch, low-noise amplifier, power amplifier and filter. It is mainly used in wireless scenes such as mobile phone and Internet of things
RF transceiver chip is located between RF front-end chip and baseband chip. It has the functions of frequency conversion, filtering, gain control and sampling to realize the mutual conversion of digital signal and analog signal
Terminal RF switch and RF refer to a chip constituting the front end of terminal RF, which is mainly used for channel switching in different switch directions (receiving or transmitting) and different frequencies in RF link
LNA refers to the low noise amplifier (LNA) of the terminal, which is a kind of LNA chip constituting the RF front end of the terminal. It is mainly used to amplify the signal received by the antenna, so as to facilitate the processing of later electronic equipment
Terminal RF power amplifier refers to power amplifier, or PA for short, which constitutes a core PA chip of terminal RF front end. It is an important part of various wireless transmitters. It will modulate the oscillation circuit
