Company code: Guangdong Fuxin Technology Co.Ltd(688662) company abbreviation: Guangdong Fuxin Technology Co.Ltd(688662) Guangdong Fuxin Technology Co.Ltd(688662)
Annual report for 2021
Important tips
1、 The board of directors, board of supervisors, directors, supervisors and senior managers of the company guarantee the authenticity, accuracy and integrity of the contents of the annual report, and there are no false records, misleading statements or major omissions, and bear individual and joint legal liabilities. 2、 Unprofitable and unprofitable when the company is listed □ yes √ no III. tips on major risks
The company has elaborated various risks that the company may face in the process of operation in this report. Please refer to section III “management discussion and analysis” of this report. 4、 All directors of the company attended the board meeting. 5、 Zhongshen Zhonghuan Certified Public Accountants (special general partnership) issued a standard unqualified audit report for the company. 6、 Liu Fulin, the person in charge of the company, Liu Chunguang, the person in charge of accounting, and Xu jieying, the person in charge of the accounting organization (Accounting Supervisor), declare that they guarantee the authenticity, accuracy and completeness of the financial report in the annual report. 7、 The profit distribution plan or the plan of converting accumulation fund into share capital in the reporting period adopted by the resolution of the board of directors
After deliberation and approval at the second meeting of the Fourth Board of directors, the company’s profit distribution plan for 2021 is as follows:
Based on the total share capital of 88240000 shares registered on the disclosure date of this announcement, it is proposed to distribute cash dividends of 4 yuan (including tax) to all shareholders for every 10 shares, with a total cash dividend of 3529 Shanghai Pudong Development Bank Co.Ltd(600000) yuan (including tax), accounting for 39.94% of the net profit attributable to shareholders of Listed Companies in the consolidated statements of the company in the current year. In 2021, the company did not distribute bonus shares and did not convert capital reserve into share capital.
The above profit distribution plan has been unanimously agreed by the independent directors of the company. The profit distribution plan shall be implemented after being deliberated and approved by the 2021 annual general meeting of shareholders of the company. 8、 Whether there are important matters such as special arrangements for corporate governance □ applicable √ not applicable IX. risk statement of forward-looking statements √ applicable □ not applicable
The future plans, development strategies and other forward-looking descriptions involved in this report do not constitute the company’s substantive commitment to investors. Please pay attention to investment risks. 10、 Is there any non operating occupation of funds by the controlling shareholders and their related parties
no
11、 Whether there is any external guarantee in violation of the specified decision-making procedures
No 12. Whether more than half of the directors cannot guarantee the authenticity, accuracy and completeness of the annual report disclosed by the company no 13. Others □ applicable √ not applicable
catalogue
Section 1 interpretation Section 2 company profile and main financial indicators 8 section III Management Discussion and Analysis Section IV corporate governance Section V environment, social responsibility and other corporate governance 79 section VI important matters Section VII changes in shares and shareholders 103 Section VIII preferred shares 112 section IX relevant information of corporate bonds Section x financial report one hundred and thirteen
The financial statements containing the signatures and seals of the legal representative of the company, the person in charge of accounting work and the person in charge of accounting organization
The catalogue of documents for future reference contains the original audit report sealed by the accounting firm and signed and sealed by the certified public accountant
During the reporting period, the CSRC formulated the text of all company documents publicly disclosed on the website and the original draft of the announcement
Section I interpretation
1、 Interpretation in this report, unless the context otherwise requires, the following words have the following meanings: common words define the company, the company, Guangdong Fuxin Technology Co.Ltd(688662) refers to Guangdong Fuxin Technology Co.Ltd(688662)
Wanshida refers to Chengdu Wanshida porcelain Co., Ltd., which is the holding subsidiary of the company
Device company refers to Guangdong Fuxin thermoelectric device technology Co., Ltd., which is a wholly-owned subsidiary of the company
Chuofeng investment refers to richly World Investment Limited, i.e. chuofeng Investment Co., Ltd
Liansheng investment refers to allied rising investment limited, namely Liansheng Investment Co., Ltd
Dongsheng international refers to Dongsheng International Development Co., Ltd
Gongqingcheng fule refers to Gongqingcheng fule investment management partnership (limited partnership)
Gongqingcheng dize refers to Gongqingcheng dize investment management partnership (limited partnership)
Zhongtai Securities Co.Ltd(600918) , sponsor and sponsor refer to Zhongtai Securities Co.Ltd(600918) institution and lead underwriter
Lawyer refers to Beijing deheheng law firm
Accountants and audit institutions refer to Zhongshen Zhonghuan Certified Public Accountants (special general partnership)
Articles of association means Guangdong Fuxin Technology Co.Ltd(688662) articles of association
Board of directors means Guangdong Fuxin Technology Co.Ltd(688662) board of directors
Board of supervisors refers to Guangdong Fuxin Technology Co.Ltd(688662) board of supervisors
Directors who are not employees of the company. He does not hold other positions in the company except for the relevant positions of directors and external directors of the board of directors, which refer to the special committee, and is not responsible for the affairs of the executive level, including Robert Frank doddsjr, fan Weixing and Lin Dongping, the third director appointed by the legal person shareholders holding more than 5% of the company’s shares.
Also known as semiconductor thermoelectric module, thermoelectric device and semiconductor thermoelectric chip, it is an electronic device composed of thermal conductive and insulating material substrate, such as copper-clad ceramic substrate, semiconductor grain, wire and other semiconductor thermoelectric device fingers, which uses the thermoelectric effect of semiconductor materials to realize the direct mutual conversion of electric energy and heat energy. According to the direction of thermoelectric conversion, It can be divided into semiconductor thermoelectric refrigeration devices and semiconductor thermoelectric power generation devices.
Thermoelectric cooling modules, also known as Tec, thermoelectric refrigeration device, semiconductor thermoelectric refrigeration component, refrigeration chip and semiconductor thermoelectric refrigeration chip, is a kind of semiconductor thermoelectric refrigeration device, which refers to an electronic device that uses the Peltier effect of semiconductor materials to realize refrigeration or heating. Tec products of the company include single-stage thermoelectric refrigeration devices, micro thermoelectric refrigeration devices, multi-stage thermoelectric refrigeration devices and other types.
Thermoelectric power generator, also known as TEG, thermoelectric device and semi-semiconductor thermoelectric device, is an electronic device that uses the Seebeck effect of semiconductor materials to realize power generation.
Peltier effect, first discovered by Peltier, a Frenchman, is a phenomenon that heat will be absorbed or released at the node when direct current passes through the circuit composed of two different conductive materials through Peltier effect.
Seebeck effect was first discovered by German scientist zebeck in 1821. Zebeck effect is the inverse process of Peltier effect. When two different conductive materials form a circuit, zebeck effect heats one node and keeps the other node low temperature. In the circuit, electromotive force is generated due to the temperature difference between the two nodes of conductive materials Phenomenon of loop current.
Also known as white sheet, it refers to the ceramic substrate with an alumina content of 96% and a thickness of about 0.25mm to 1.2mm. 96% alumina ceramic substrate has high thermal conductivity, good insulation strength, high pressure resistance, high temperature resistance and corrosion resistance. It is the basic material for making ceramic circuit boards.
Copper clad ceramic substrate is an electronic basic material made by directly sintering copper foil and copper clad sector on the surface of ceramic substrate using DBC (direct bond copper) technology. It has excellent heat cycle resistance, stable shape, high thermal conductivity, high reliability, large current capacity and high mechanical strength.
The dimensionless thermoelectric performance merit value ZT is a composite parameter obtained by calculating the physical property parameters of zebeck coefficient, conductivity and thermal conductivity ZT value index and the corresponding temperature. It is a comprehensive embodiment of the thermal and electrical characteristics of materials. The larger the ZT value of thermoelectric materials, the higher the thermoelectric conversion efficiency.
The conversion efficiency between thermal energy and electric energy is divided into power generation efficiency and refrigeration efficiency according to the different conversion directions from thermal energy to electric energy and from electric energy to hot (cold) energy. Thermoelectric conversion efficiency refers to the electrical efficiency, which is defined as the ratio of the electrical power output from the device to the load and the heat absorption power of the device, that is, the output electrical energy converted from the unit input heat energy to the load. Refrigeration efficiency is defined as the ratio of the refrigeration power of the device to the input electric power, that is, the cold energy generated by the unit electric energy.
Bismuth telluride (Bi2Te3) based thermoelectric material was found in the 1950s. This material refers to the material with excellent thermoelectric properties near room temperature. It is widely used in refrigeration and power generation near room temperature. It is the only thermoelectric material system widely commercialized in thermoelectric materials at present.
Semiconductors and holes are their own conductive mechanisms. In semiconductors, valence electrons are bound by atomic nuclei and cannot move by themselves in crystals. Free electrons and holes are valence p-type and n-type semiconductors, which are produced by changing the motion state of electrons after being excited by heat. For n-type semiconductors, the conductive mechanism is a free electron, and for p-type semiconductors, the conductive mechanism is a hole. The difference between n-type semiconductors and free electrons is that the charge is equal and the symbol is opposite.
The size index of thermoelectric refrigeration device refers to w refers to the width of refrigeration device substrate, L1 refers to the length of cold end substrate, L2 refers to the length of hot end substrate, and H refers to the height of refrigeration device.
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