Sihui Fuji Electronics Technology Co.Ltd(300852)
2021 Annual Report
2022025
March 2022
Section I important tips, contents and definitions
The board of directors, the board of supervisors and the directors, supervisors and senior managers of the company guarantee that the contents of the annual report are true, accurate and complete without false records, misleading statements or major omissions, and bear individual and joint legal liabilities.
Liu Tianming, the person in charge of the company, Cao Yijian, the person in charge of accounting, and Cao Yijian, the person in charge of the accounting organization (Accounting Supervisor), declare that they guarantee the authenticity, accuracy and completeness of the financial report in this annual report.
All directors have attended the meeting of the board of directors to consider this report.
The company’s investment plan for the year does not constitute a rational and forward-looking commitment to investors. Please pay attention to the risks involved in the company’s investment plan for the year. In Section IV “prospects for the future development of the company” of this report, the company describes in detail the possible risks and Countermeasures in the operation of the company. Please pay attention to the relevant contents.
The profit distribution plan approved by the board of directors is: Based on the total share capital registered on the equity registration date when the equity distribution of the company is implemented in 2021, the company will distribute cash dividends of 3.30 yuan (including tax) to all shareholders for every 10 shares, give bonus shares of 0 shares (including tax), and transfer capital reserve to all shareholders for every 10 shares.
catalogue
Section I important tips, contents and definitions Section 2 company profile and main financial indicators Section III Management Discussion and Analysis Section IV corporate governance Section V environmental and social responsibility 56 section VI important matters Section VII changes in shares and shareholders Section 8 preferred shares 88 section IX relevant information of bonds 89 section x financial reporting ninety
Directory of documents for future reference
The documents for reference of the company’s 2021 annual report include:
1. The original of the full text of the 2021 annual report signed by the legal representative of the company;
2. Financial statements containing the signatures and seals of the person in charge of the company, the person in charge of accounting work and the person in charge of accounting institutions;
3. Originals of all documents and announcements publicly disclosed on the website designated by the CSRC during the reporting period;
4. Other documents for future reference.
The location of the above documents for reference: the Securities Affairs Department of the company.
interpretation
Explanatory item refers to the explanatory content
Sihui Fuji Electronics Technology Co.Ltd(300852) , the company and the company refer to Sihui Fuji Electronics Technology Co.Ltd(300852)
Fushi technology refers to Sihui Fuji Electronics Technology Co.Ltd(300852) Technology Co., Ltd., a wholly-owned subsidiary of the company
Hongke electronics refers to Hongke Electronic Technology (Sihui) Co., Ltd., a wholly-owned subsidiary of the company
Aituo technology refers to Sihui aituo Technology Co., Ltd., a wholly-owned subsidiary of the company
Hong Kong Fushi refers to Sihui Fuji Electronics Technology Co.Ltd(300852) Electronics (Hong Kong) Co., Ltd., a wholly-owned subsidiary of the company
Sihui Mingcheng refers to Sihui Mingcheng Trading Co., Ltd., the controlling shareholder of the company
Tiancheng Tongchuang refers to Sihui Tiancheng Tongchuang investment partnership (limited partnership), the shareholder of the company
Yiming investment refers to Sihui Yiming Investment Co., Ltd., the shareholder of the company
The reporting period refers to the period from January 1, 2021 to December 31, 2021
The full English name “printed circuit board” refers to the substrate for assembling electronic parts. It refers to the printed circuit board that forms the connection between points and printed components on the general substrate according to the predetermined design. It can also be called “printed circuit board” and “printed circuit board”
Double sided board refers to a PCB that forms a conductor pattern on both sides of the substrate
Multilayer board refers to a board that uses several single-sided or double-sided boards and is pressed after putting an insulating layer between each board
Rigid flexible sector refers to the combination of rigid sector and flexible sector, which can not only provide the support function of rigid sector, but also have the bending characteristics of flexible sector, and can meet the needs of three-dimensional assembly. It is also called “soft hard sector”
Thick copper sector refers to the printed circuit board using thick copper foil (copper thickness is 3 ounces and above) or any layer of finished product with copper thickness of 3 ounces and above
HDI is the abbreviation of high density interconnect, that is, high-density interconnection technology.
HDI is a kind of printed circuit board technology. It is a method used to make high-precision circuit board with the more precise development of electronic technology. It can realize high-density wiring. Generally, HDI board is made by lamination method. HDI board usually refers to a multilayer printed circuit board with a pore diameter of less than 0.15mm (6mil) (mostly blind holes), a ring diameter of less than 0.25mm (10mil), a contact density of more than 130 points / square inch and a wiring density of more than 117 inches / square inch
Metal substrate refers to a composite printed circuit board composed of metal substrate, insulating medium layer and circuit layer
Part of the process of manufacturing Ordinary rigid circuit board on special high-frequency copper clad laminate
High frequency high-speed board refers to the printed circuit board produced by special processing methods, which is used in the field of high frequency and high-speed transmission
Copper clad laminate (CCL for short) is the basic material for manufacturing PCB. It has the functions of copper clad laminate / substrate / substrate / CCL guiding electricity, insulation and support. It can be divided into two categories: rigid materials (special substrates such as paper, glass fiber, composite, ceramic and metal) and flexible materials
The full name is any layer inner via hole (any interconnection HDI), that is, the interconnection hole technology in any layer. Generally, HDI is the board layer between the PCB layer and any layer of the layer directly through the machine drill in the drilling process, and any layer HDI connects the layers by laser drilling, The middle substrate can omit the use of copper foil substrate to make the product lighter and thinner. Changing from HDI to any layer HDI can reduce the volume by about 40%.
It refers to a special process board in which copper foil is directly bonded to the surface (one or two sides) of alumina (Al2O3) or aluminum nitride (AlN) ceramic substrate at high temperature. The ultra-thin composite substrate has excellent ceramic substrate, which means good electrical insulation performance, high thermal conductivity, excellent soldering and high adhesion strength. It can etch various patterns like PCB board and has great current carrying capacity. Therefore, ceramic substrate has become the basis of high-power power electronic circuit structure technology and interconnection technology
Material Science.
Japanese entrepreneur and philosopher Kazuo Inamori founded an international advanced enterprise management model
“Amoeba” refers to the operation. It means that the organization will be divided into small independent business units for independent accounting, and the person in charge of the independent business unit will be fully authorized to establish an incentive mechanism directly related to the achievement of its business objectives, so as to realize the participation of all employees in the operation
It refers to the abbreviation of printed circuit board assembly, that is, the whole process of PCB bare board through SMT, PCBA and dip plug-in
Section II Company Profile and main financial indicators
1、 Company information
Stock abbreviation Sihui Fuji Electronics Technology Co.Ltd(300852) stock code Sihui Fuji Electronics Technology Co.Ltd(300852)
Chinese name of the company Sihui Fuji Electronics Technology Co.Ltd(300852)
Chinese abbreviation of the company Sihui Fuji Electronics Technology Co.Ltd(300852)
The foreign language name of the company (if any) Sihui Fuji Electronics Technology Co., Ltd
Legal representative of the company: Liu Tianming
Company Registered Address
