Securities code: Puya Semiconductor (Shanghai) Co.Ltd(688766) securities abbreviation: Puya Semiconductor (Shanghai) Co.Ltd(688766) Announcement No.: 2022006 Pran semiconductor (Shanghai) Co., Ltd
Voluntary disclosure announcement on the research and development progress of new products and technologies
The board of directors and all directors of the company guarantee that there are no false records, misleading statements or major omissions in the contents of this announcement, and bear individual and joint liabilities for the authenticity, accuracy and completeness of its contents.
In order to facilitate investors to understand the progress of the company’s new product and technology research and development, Pran semiconductor (Shanghai) Co., Ltd. (hereinafter referred to as the “company”) now discloses the progress of the company’s new product and technology research and development as follows:
1、 Research and development progress of new products and technologies
(I) the direction of memory chip is fully developed:
1. The company adopts the SONOS process structure of charge capture. The whole series of NOR flash products under the 40nm process node have been developed and become the main force of mass production and delivery. The wafer yield has reached more than 95%, which has realized the upgrading and replacement of the NOR flash products under the company’s original 55nm process node, and the product competitiveness and wafer yield have been effectively improved. Among them, l series 64MB nor flash products have completed TWS Bluetooth headset certification of overseas mobile phone head manufacturer. The new generation process with technical reserve below 40nm has completed the test strip and entered the stage of product and process optimization. 2. The company adopts the floating gate etox process structure, and the high-capacity py series products in NOR flash are the first to start mass production and shipment, which are applied to wearable, security and other markets.
3. The on-board EEPROM products have completed the comprehensive assessment of aec-q100 standard. Firstly, the batch delivery of overseas customers has been realized in the application of body camera and on-board central control.
4. The development of super large capacity EEPROM series has been completed. F series products support SPI / I2C interface and maximum 4MB capacity, of which 2MB products are applied in the field of high-speed broadband communication and data center in batch. The floating gate next generation technology developed in strategic cooperation with the foundry has entered the stage of test chip development.
5. The new generation of 128KB to 512KB camera module EEPROM products have been applied to the flagship models of overseas mobile phone head manufacturers, and mass production has been realized. 128KB products of 1.2V camera module EEPROM L series supporting the next generation mobile phone main control platform took the lead in entering the market, completed platform certification, and delivered the first mobile phone customer project in small quantities.
(II) promotion of “storage +” strategic layout:
In the direction of analog products, PE series voice coil motor drive chips with built-in nonvolatile memory are supplied in large quantities. The 1.2V PD series voice coil motor drive chip products supporting the next generation main control platform have been developed, streamed and tested. The performance indicators meet the specification requirements, and the products enter the customer sample delivery stage.
In the direction of microcontroller, the first 32-bit microcontroller chip passed the function and performance test and entered the customer sample delivery stage.
2、 Impact of new product and technology research and development on the company
1. New products can be oriented to industrial control, vehicle and other application fields, enrich the company’s product line, help consolidate and enhance the company’s core competitiveness, form new growth points, and have a positive impact on the company’s future development;
2. The development of new products gives the company the opportunity to serve more head customers, improve the company’s market position, base itself on the Chinese market and participate in the global market competition;
3. The innovative technology reserve of the new generation process below 40Mn and the next generation technology of floating gate make the company continuously competitive in the field of memory chip and extension.
3、 Relevant risk tips
It takes a long time for the company’s new products to be introduced into the vehicle, industrial control and other high-end markets, as well as to the head customers in various fields. Mass sales still need a certain cycle and early-stage technical service investment, which is uncertain. At the same time, it faces the risk that the future market promotion and customer development are not as expected. Please pay attention to investment risks and invest rationally.
It is hereby announced.
Board of directors of Pran semiconductor (Shanghai) Co., Ltd. March 21, 2022
