Securities code: Will Semiconductor Co.Ltd.Shanghai(603501) securities abbreviation: Will Semiconductor Co.Ltd.Shanghai(603501) Announcement No.: 2022019 convertible bond Code: 113616 convertible bond abbreviation: Weill convertible bond
Will Semiconductor Co.Ltd.Shanghai(603501)
Announcement on the investigation of reception institutions
The board of directors and all directors of the company guarantee that there are no false records, misleading statements or major omissions in the contents of this announcement, and bear individual and joint liabilities for the authenticity, accuracy and completeness of its contents.
Will Semiconductor Co.Ltd.Shanghai(603501) (hereinafter referred to as "the company") received the institutional research through teleconference on March 15, 2022. Now the situation is announced as follows:
1、 Investigation
Time: 18:00-19:00, March 15, 2022
Research method: teleconference communication
Names of research institutions (in no order): Guosheng securities, Harvest Fund, Fuguo fund, huitianfu fund, Hua'an fund, Galaxy fund, BOCOM Schroeder, Taiping assets, GF fund, BOC fund, Ruiyuan capital, Pengyang fund, Morgan Huaxin, Jinglin capital, Societe Generale fund, Western profit, Yinhua Fund, Societe Generale global, Huatai Baoxing, Gaoyi assets Qianhai Kaiyuan
Receptionists: Mr. Wang song, general manager, Mr. Jia Yuan, director and chief financial officer, Mr. Wu Xiaodong, senior vice president of global sales and marketing, and Ms. Ren Bing, Secretary of the board of directors
2、 Summary of the main questions exchanged and the company's reply
1. What are the competitive advantages of the company's on-board CIS compared with other suppliers? How about the introduction of customers? The company has invested in research and development in the on-board field for more than 16 years, and the products cover the range from VGA to 8 million pixels, which can meet the expansion of product application fields from traditional reversing radar image and tachograph to electronic rear-view mirror, 360 degree panoramic imaging, advanced driving assistance system (ADAS) Driver monitoring (DMS) and other fields. The products sold by the company are more complete than those of its friends, especially the products with a large market share in the range of 1.3 million to 3 million pixels in recent years. As a leading chip design company in China, the company has close cooperation with the world's mainstream wafer factories. The company has sufficient capacity to meet the demand of the company's share growth.
The company's product quality has been recognized by many automobile brands outside China. The company has deep cooperation with foreign manufacturers in China, and has obtained scheme introduction in many model schemes. In the past two years, based on the cooperation of the original mainstream automobile brands in Europe and America, the company has introduced a large number of schemes into Chinese traditional automobile brands and new forces in automobile manufacturing, which will also bring new revenue and profit growth points to the company. At the same time, the company also has a breakthrough in the introduction of schemes in car enterprises such as Japan and South Korea.
2. What is the layout direction of the company in automotive products
For the company, in the near future, cars will become the second largest business market after mobile phones. At present, the global intelligent automobile industry is in a period of rapid development. With the continuous improvement of automatic driving level, the number of CIS used by single vehicle has increased from 1 ~ 2 to more than 10. The company's on-board CIS will usher in the opportunity of both volume and price.
The company has a product quality system and R & D strength recognized by global automobile brands. Focusing on the automobile market, in addition to image sensors, the company has continued to increase R & D investment in MCU, LVDS, LCOS, power IC, MOS, drive and other fields. It will gradually enter the automobile market in recent one or two years to provide customers with overall solutions. Under the trend of automobile electronization and intellectualization, the company will usher in huge business opportunities.
3. What is the business layout of AR / VR
The company's CMOS image sensor, cameracubechip, LCOS, touch chip, power IC and other products have been used in the AR / VR field, and the value provided by a single machine continues to increase. CMOS image sensor is one of the core chips to realize the application scenarios in the AR / VR field. The company's profound product and technology accumulation has been widely recognized in the industry. The company's industry-leading BSI global shutter and other technologies will provide customers with high-quality eye tracking, facial expression recognition and other solutions to help ar / VR head display equipment customers develop more functions High performance product solutions.
4. Whether the company's image sensors are mainly aimed at high-end models to make high-pixel products in the range of low-end, middle-end and high-end mobile phone shipments in the future
The company has a good market share in Android smartphones in different price ranges, and the proportion of high-order pixel products in the operating revenue of the company's mobile phone CIS continues to increase. In terms of specific product models, the company has successfully launched 50 million to 200 million pixel products with different pixel sizes to meet the application needs of smart phones in different price ranges. The company will continue to increase R & D investment in high-order pixel products. In addition, the company will increase R & D investment in the field of event based image sensor (EVS) and hyperspectral image sensor to achieve higher product performance. The company is the first company in the world to break through the 0.56 micron pixel size technology node, and will provide customers with higher performance and cost-effective solutions in future products.
5. How does the customer introduction of touch and display chips look forward to the next year
Tddi is an important branch of the company's touch display products. In 2021, the company's tddi products were mass produced in many first-line mobile phone brand customer schemes, with a revenue of more than 1.8 billion yuan, a year-on-year increase of about 160%. The scheme has been applied to the head of the company's smart phone in 2022 and has passed the verification of the company's products in China. The company will also continue to increase R & D investment in the field of small and medium-sized screens to achieve coverage in the automotive, laptop, tablet and other markets.
6. What is the layout of the company in the field of analog chips
Based on the core intellectual property rights of the original simulation business, the company will launch more products in the application fields related to image sensors and screen display. In addition, the company's R & D investment in medium and high voltage MOS, IGBT and other fields in recent years will be successively realized in the company's performance, and the company has also arranged the R & D investment of SiC products. The company will continue to give full play to the advantages of platform, enhance the R & D capacity of analog products by expanding the R & D team, and realize the rapid growth of analog chip field.
It is hereby announced.
Will Semiconductor Co.Ltd.Shanghai(603501) board of directors March 16, 2022
