China Securities Co.Ltd(601066)
about
Changzhou Galaxy Century Microelectronics Co.Ltd(688689) issue convertible corporate bonds to unspecified objects and list them on the science and innovation board
of
Listing recommendation
Sponsor
December, 2001
Statement of recommendation institution and recommendation representative
China Securities Co.Ltd(601066) and the declaration of the sponsor representative of the project, Wang Jiahai, in accordance with the company law of the people's Republic of China, the securities law of the people's Republic of China and other relevant laws and regulations, as well as the relevant provisions of the CSRC and Shanghai Stock Exchange, is honest, trustworthy, diligent and responsible, and issues this listing recommendation letter in strict accordance with the business rules, industry practice norms and moral standards formulated according to law, And ensure the authenticity, accuracy and completeness of the listing recommendation letter.
catalogue
interpretation...... 3 I. Basic information of the issuer 4. II. The issuer's current offering III. sponsor representatives and other members of this securities issuance and listing 12 IV. explanation on whether the recommendation institution has any circumstances that may affect the fair performance of recommendation duties V. matters that the recommendation institution should undertake in accordance with relevant provisions Vi. explanation of the recommendation institution on whether the issuer has fulfilled the decision-making procedures stipulated in the company law, the securities law and the CSRC and Shanghai stock exchange with respect to the issuance and listing of Securities 15 VII. The sponsor's arrangements for continuous supervision 16 VIII. Contact information of the recommendation institution and the recommendation representative IX. recommendation conclusion of the recommendation institution on this securities issuance seventeen
interpretation
In this listing recommendation letter, unless the context otherwise requires, the following words have the following meanings: recommendation institution, lead underwriter, CITIC index China Securities Co.Ltd(601066) construction investment, China Securities Co.Ltd(601066) securities
China Securities Co.Ltd(601066) with regard to Changzhou Yinhe century Microelectronics Co., Ltd., this listing recommendation refers to the recommendation that the company issues convertible corporate bonds to unspecified objects and is listed on the science and innovation board
Company, issuer and listed company refer to Changzhou Galaxy Century Microelectronics Co.Ltd(688689) Changzhou Galaxy Century Microelectronics Co.Ltd(688689)
This project refers to the project that Changzhou Galaxy Century Microelectronics Co.Ltd(688689) issues convertible corporate bonds to unspecified objects and is listed on the science and innovation board
The current issuance of convertible corporate bonds to unspecified objects refers to Changzhou Galaxy Century Microelectronics Co.Ltd(688689) the issuance of convertible corporate bonds to unspecified objects and listing on the science and innovation board
Shares and A-Shares refer to ordinary shares approved to be listed on domestic stock exchanges, marked with face value in RMB, subscribed and traded in RMB
CSRC refers to the China Securities Regulatory Commission
Shanghai Stock Exchange and stock exchange refer to Shanghai Stock Exchange
Company law means the company law of the people's Republic of China
Securities Law means the securities law of the people's Republic of China
The measures for the administration of issuance of science and Innovation Board refers to the measures for the administration of securities issuance and registration of listed companies on science and Innovation Board (for Trial Implementation)
The Listing Rules of sci tech Innovation Board refer to the Listing Rules of sci tech Innovation Board of Shanghai Stock Exchange
Articles of association means the Changzhou Galaxy Century Microelectronics Co.Ltd(688689) articles of association
General meeting means Changzhou Galaxy Century Microelectronics Co.Ltd(688689) general meeting of shareholders
Board of directors means the Changzhou Galaxy Century Microelectronics Co.Ltd(688689) board of directors
Board of supervisors means Changzhou Galaxy Century Microelectronics Co.Ltd(688689) the board of supervisors
Raised investment projects refer to the projects to be invested with the funds raised from this issuance
The reporting period refers to 2018, 2019, 2020 and January September 2021
The end of each reporting period refers to the end of 2018, 2019, 2020 and September 2021
Yuan, ten thousand yuan and one hundred million yuan refer to RMB, ten thousand yuan and one hundred million yuan
Note 1: unless otherwise specified, the abbreviation of this listing recommendation letter has the same meaning as the abbreviation in Changzhou Galaxy Century Microelectronics Co.Ltd(688689) prospectus for issuing convertible corporate bonds to unspecified objects. Note 2: if there is any discrepancy between the mantissa of the total number and the sum of the itemized values, or there is a difference between the mantissa after the decimal point and the original data, it may be caused by different exact digits or rounding.
1、 Basic information of the issuer
(i) Issuer profile
Chinese name Changzhou Galaxy Century Microelectronics Co.Ltd(688689)
English Name: Changzhou Galaxy century Microelectronics Co., Ltd
Legal representative: Yang Senmao
Registered address: No. 19, Changjiang North Road, Xinbei District, Changzhou City
Date of establishment: October 8, 2006
Listing time: January 27, 2021
The registered capital is 128.4 million yuan
Stock abbreviation Changzhou Galaxy Century Microelectronics Co.Ltd(688689)
Stock Code: 688689
Shanghai stock exchange where the shares are listed
Board Secretary Li Fucheng
Tel.: 0519-68859335
company website https://www.gmesemi.com./
Chip diodes, semiconductor discrete devices, integrated circuits, optoelectronic devices and other electronic devices, electrical business scope: manufacturing of electronic components, semiconductor chips and special materials. (for projects subject to approval according to law, business activities can be carried out only after approval by relevant departments)
（2） The issuer's main business, core technology and R & D level
1. Main business of the issuer
The company is a high-tech enterprise focusing on the R & D, production and sales of semiconductor discrete devices
Various small signal devices (small signal diode, small signal triode), power devices (power diode, power transistor)
Rate triode, bridge rectifier) and other semiconductor discrete device products. The company is based on packaging and testing expertise
At present, it preliminarily has the integrated operation ability under IDM mode, and can provide customers with strong applicability
High reliability series products and technical solutions to meet customers' one-stop procurement needs. The company has a wide range of products
It is used in computer and peripheral equipment, household appliances, adapters and power supplies, network communication, automotive electronics, industry and commerce
Industry control and other fields.
2. Core technology and R & D level of the issuer
(1) Core technologies mastered by the company
The manufacturing process of discrete devices is highly standardized, and the technology is generally combined with specific process links
If the specific problem of a process node is solved, the technology can be widely used in multiple series using this process
Products.
The company has mastered the general technology of discrete device packaging and testing, which is the mainstream in the industry
The test process was optimized to achieve accurate control, and gradually mastered the characteristics of some kinds of chips of power diodes
Design and manufacturing technology, as follows:
The process uses this nuclear correspondence
Link core technology description and characteristics main invention patent of core technology
Want products
The multi arrangement of frame design increases the number of products in each frame and improves the single small signal diode
The number of products in the high-density array bit area can improve production efficiency and reduce material consumption. Tube and optocoupler (1) ultra thin packaging frame design technology taking SOT-23 as an example, the number of products per square centimeter is increased from 4.75 to 5.71, and the density is increased by 20%. Diode, bridge technology; (2) Large current rectifier / high voltage diode
Solder paste or solder chip is pre welded on both sides of the chip, and a process is added to improve the preparation method; The chip pre welding technology has obvious effects in improving the efficiency of the welding process and reducing chip contamination. A semi conducting air hole of the welding bridge rectifier (3) is reduced from 5% to less than 3%. Welding of bulk chip
Insulating film mounting technology is an important supporting technology of multi chip stack packaging, which can meet the same or small signal diode method; (4) Due to different chip stacking requirements of core technology, the connection between the bottom of the chip and the base island will not be coated with tin overflow glue on the back of the segment, and achieve accurate chip loading effect. Paste loading formula
On the basis of general technology, through the special control of welding wire process parameters, small signal diode method; (5) The invention relates to an improvement of ultra-low radian welding wire and welding wire method, so that the separation technology of small signal device packaging welding wire arc height tube and small signal semiconductor rectifier bridge can be controlled below 40um at least, so as to realize the ultra-thin product and the preparation method of triode; For device assembly, such as dfn0603, the thickness is less than 0.25 mm. (6) The dispensing amount of axial diode packaging technology CPK performs statistical process control by automatically detecting the dispensing amount of each product, and the automatic measurement and control of power diode and protective adhesive layer test, so as to improve the control degree of the chip and ensure that the dispensing amount of each point is within the scope of polyimide Technology of controlled tube and bridge. Axial diode of current transformer
Power chip tin painting is a preparation method through the uniform walking of a special dispensing needle within the dispensing range; The welding technology makes the glue amount more uniform and the position more controllable, so as to achieve the purpose of uniform solder and reducing the hexagonal hole of the welding gas power diode (7), which can improve the performance and reliability of the power device. Chip filter
Adjust the light transmittance of silica gel, control the dispensing height and screen the formula through the proportion of silica gel color paste
The optocoupler CTR control and control chip are precisely adjusted according to the angle, and the control technology is implemented
