Electronic components industry express: domestic silicon carbide substrates continue to break through, and the bidding of semiconductor equipment continues to boom

Chinese manufacturers have successfully developed 8-inch silicon carbide substrate and achieved technological breakthrough: according to the official micro disclosure of CETC materials, its subordinate Shanxi shuoko crystal has successfully developed 8-inch silicon carbide crystal and realized the small batch production of 8-inch n-type silicon carbide polishing wafer. According to the wind direction information of the third generation semiconductor, on March 2, the Swiss electric vehicle Kincsem announced the launch of the hybrid model Kincsem hyper-gt, and its inverter may adopt the silicon carbide scheme. Toyota’s new fuel cell vehicle Mirai, SAIC jet hydrogen and zhizhan technology’s fuel cell vehicles also began to adopt the silicon carbide technology. On February 28, the official wechat of Shanghai Dingtai craftsman core technology Co., Ltd. disclosed that the main Fab plant of its 12 inch vehicle scale power semiconductor automatic wafer manufacturing center project was capped, with a total investment of 12 billion yuan and an area of 198 mu, which can achieve an annual output of 36 Csg Holding Co.Ltd(000012) inch power devices. On the same day, Qingdao high tech Zone held the launching ceremony of key project construction in spring 2022, Among them, the investment of Huaxin Jingyuan third generation semiconductor compound wafer substrate project is 700 million yuan, with a construction area of 54000 square meters and a production capacity of 330000 pieces.

Canalys predicts that the shipment of foldable smart phones will grow at a compound annual growth rate of 53%, and is expected to grow to 31.85 million in 2024: with the deepening contradiction between the large screen and convenience of smart phones, foldable screen phones have become an effective solution to this problem. Major manufacturers have laid out the folding screen mobile phone market. In September 2021, Samsung launched Galaxy Z fold3 and Galaxy Z flip3 folding screen mobile phones in China. The internal main screen and external screen are equipped with the second-generation dynamic AMOLED screen, and the performance has been improved; In December, oppo released its first folding screen mobile phone findn, a combination of UTF glass and water drop hinge, which largely solved the problem of visible creases and broke through the lower price limit of folding screen mobile phones; In the same period, Huawei launched a new series of folding screen mobile phone P50 pocket and proudly launched magic v. In the future, the folding screen smartphone market will be mainly competed by Samsung and Chinese manufacturers. According to counterpoint, the sales volume of Samsung’s folding smart phones will reach 12-13 million in 2022, still occupying the leading position. With the continuous iterative upgrading of technology and the obvious downward trend of price, the market scale of folding screen smart phones will be further expanded, resulting in an increase in the demand for front cover materials, displays and other components.

The bidding for semiconductor equipment continued to boom, and Naura Technology Group Co.Ltd(002371) won more than one equipment: the bidding for semiconductor equipment this week (202202.28 – 202203.04): according to the data of electronic trading platform for bidding and tendering of mechanical and electrical products, Shanghai Jita added 21 bidding equipment this week, Shanghai Hualiji cost added 1 bidding equipment this week, and Huahong Wuxi added 18 bidding equipment this week. In terms of domestic equipment, Naura Technology Group Co.Ltd(002371) won the bid for 2 sets of polycrystalline gate plasma etchers, 2 sets of active area plasma etchers, 1 set of physical vapor deposition equipment and 2 sets of titanium nitride sputtering mask layer equipment.

Investment suggestions: recommend Starpower Semiconductor Ltd(603290) , Wingtech Technology Co.Ltd(600745) , China Resources Microelectronics Limited(688396) , focus on SiC Zhuzhou Crrc Times Electric Co.Ltd(688187) , Roshow Technoiogy Co.Ltd(002617) , Hebei Sinopack Electronic Technology Co.Ltd(003031) , Phenix Optical Company Limited(600071) , etc. in the field of power semiconductors; Recommend Shanghai Wanye Enterprises Co.Ltd(600641) , Kunshan Kinglai Hygienic Materials Co.Ltd(300260) , Suzhou Uigreen Micro&Nano Technologies Co.Ltd(688661) , Naura Technology Group Co.Ltd(002371) , pay attention to Pnc Process Systems Co.Ltd(603690) , Suzhou Hyc Technology Co.Ltd(688001) , etc. for semiconductor equipment; Mini led recommends Shenzhen Xinyichang Technology Co.Ltd(688383) , Hongli Zhihui Group Co.Ltd(300219) , pays attention to Shenzhen Refond Optoelectronics Co.Ltd(300241) , Shenzhen Longli Technology Co.Ltd(300752) , etc; PCB pays attention to Shennan Circuits Co.Ltd(002916) , Wus Printed Circuit (Kunshan) Co.Ltd(002463) , Shenzhen Fastprint Circuit Tech Co.Ltd(002436) , Victory Giant Technology (Huizhou)Co.Ltd(300476) , Shenzhen Kinwong Electronic Co.Ltd(603228) , Guangdong Ellington Electronics Technology Co.Ltd(603328) , etc; IC design focuses on Montage Technology Co.Ltd(688008) , Shanghai Belling Corp.Ltd(600171) , Sg Micro Corp(300661) , Chipsea Technologies (Shenzhen) Corp.Ltd(688595) , Ninestar Corporation(002180) , etc.

Risk warning: downstream demand is less than expected; Domestic substitution is less than expected; Continuous risk of epidemic impact

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