Market overview of this week:
This week, the Shenwan semiconductor industry index fell 3.56%, the gem index fell 0.34% in the same period, the Shanghai Composite Index rose 1.63%, the Shenzhen Composite Index rose 1.47%, the small and medium-sized board index rose 2.82%, and wandequan a rose 1.16%. The semiconductor industry index significantly underperformed the major indexes. The semiconductor segment fell as a whole. Among the semiconductor segments, the semiconductor material segment fell 2.6%, the discrete device segment fell 2.7%, the semiconductor equipment segment fell 1.4%, the semiconductor manufacturing segment rose 0.3%, the IC Design segment fell 2.6%, the packaging and testing segment fell 3.4% and other segments rose 2.5% this week.
Silicon carbide has the advantages of high frequency / high pressure / high temperature and other materials
Compared with Si, SiC has strong advantages in working frequency, high temperature resistance and high pressure resistance. In terms of device type, SiC MOSFET is similar to Si MOSFET. But, SiC is a wide band gap (WBG) materials, whose characteristics allow these devices to operate at the same high power level as IGBT, while still switching at high frequency. These characteristics can be transformed into system advantages, including higher power density, higher efficiency and lower heat dissipation. However, SiC faces high technical requirements in manufacturing and application, so SiC devices are expensive , it will take some time to realize full commercialization.
China has begun to establish a silicon carbide industry chain, which is expected to realize a positive cycle with the development of technology
According to yole, Cree, Infineon, Roma, st and other European and American manufacturers occupy the main SiC market share in the world. In addition, Cree and II-IV will account for 63% of the global semi insulating SiC substrate Market in 2020. In the SiC device industry chain, substrate is the most important manufacturing link, accounting for 47% of the cost in SiC devices. In terms of product layout, many Chinese enterprises have begun to layout the SiC market. Some local enterprises have developed 6-inch conductive SiC substrates and high-purity semi insulating SiC substrates. At the same time, some local enterprises have begun to build SiC device production lines.
It is recommended to pay attention to:
1) Semiconductor design: Sg Micro Corp(300661) / 3Peak Incorporated(688536) / Montage Technology Co.Ltd(688008) / Amlogic (Shanghai) Co.Ltd(688099) / Rockchip Electronics Co.Ltd(603893) / Sino Wealth Electronic Ltd(300327) / Starpower Semiconductor Ltd(603290) / Macmic Science & Technology Co.Ltd(688711) / Wuxi Nce Power Co.Ltd(605111) / Allwinnertech Technology Co.Ltd(300458) / Bestechnic (Shanghai) Co.Ltd(688608) / Shanghai Fullhan Microelectronics Co.Ltd(300613) / Gigadevice Semiconductor (Beijing) Inc(603986) / Will Semiconductor Co.Ltd.Shanghai(603501) / Maxscend Microelectronics Company Limited(300782) / Shanghai Bright Power Semiconductor Co.Ltd(688368) / Wuxi Chipown Micro-Electronics Limited(688508) / Unigroup Guoxin Microelectronics Co.Ltd(002049) / Shanghai Fudan
2） IDM: Wingtech Technology Co.Ltd(600745) / Sanan Optoelectronics Co.Ltd(600703) / Zhuzhou Crrc Times Electric Co.Ltd(688187) / Hangzhou Silan Microelectronics Co.Ltd(600460) ；
3) Wafer Foundry: Semiconductor Manufacturing International Corporation(688981) / Huahong semiconductor;
4) Semiconductor equipment materials: Naura Technology Group Co.Ltd(002371) / Jiangsu Yoke Technology Co.Ltd(002409) / Shanghai Sinyang Semiconductor Materials Co.Ltd(300236) / Advanced Micro-Fabrication Equipment Inc.China(688012) / Wuhan Jingce Electronic Group Co.Ltd(300567) / Beijing Huafeng Test & Control Technology Co.Ltd(688200) / Hangzhou Chang Chuan Technology Co.Ltd(300604) / Grinm Advanced Materials Co.Ltd(600206) / Jiangyin Jianghua Microelectronics Materials Co.Ltd(603078) ;
Risk warning: the epidemic situation continues to deteriorate; The impact of trade war; Demand is less than expected
