Company code: 688082 company abbreviation: shengmei Shanghai shengmei semiconductor equipment (Shanghai) Co., Ltd. 2021 Annual Report
Important tips
1、 The board of directors, board of supervisors, directors, supervisors and senior managers of the company guarantee the authenticity, accuracy and integrity of the contents of the annual report, and there are no false records, misleading statements or major omissions, and bear individual and joint legal liabilities. 2、 Unprofitable and unprofitable when the company is listed □ yes √ no III. tips on major risks
During the reporting period, there were no particularly significant risks that had a material impact on the company’s production and operation. The company has described the possible risks in detail in the report. Please refer to “section III Management Discussion and analysis: IV. risk factors”. 4、 All directors of the company attended the board meeting. 5、 Lixin Certified Public Accountants (special general partnership) issued a standard unqualified audit report for the company.
6、 Hui Wang, the person in charge of the company, Lisa Yi Lu Feng, the person in charge of accounting, and Lisa Yi Lu Feng, the person in charge of accounting organization (Accounting Supervisor), declare that they guarantee the authenticity, accuracy and completeness of the financial report in the annual report.
7、 The profit distribution plan or the plan of converting accumulation fund into share capital in the reporting period adopted by the resolution of the board of directors
Fully considering that the company is currently in the development period, the R & D projects and business scale are expanding, and the capital demand is large, in order to better safeguard the long-term interests of all shareholders and ensure the sustainable development and capital demand of the company, the company plans not to distribute profits or convert capital reserve into share capital in 2021. This proposal has been deliberated and approved at the 17th meeting of the first board of directors of the company and needs to be deliberated at the 2021 annual general meeting of shareholders of the company. 8、 Whether there are important matters such as special arrangements for corporate governance □ applicable √ not applicable IX. risk statement of forward-looking statements √ applicable □ not applicable
The company’s planning, development strategy and other non fait accompli forward-looking statements involved in this report do not constitute the company’s substantive commitment to investors. Please pay attention to the relevant risks. 10、 Is there any non operational occupation of funds by the controlling shareholders and their related parties? No
11、 Whether there is any external guarantee in violation of the specified decision-making procedures? No 12. Whether more than half of the directors cannot guarantee the authenticity, accuracy and integrity of the annual report disclosed by the company? No 13. Others □ applicable √ not applicable
catalogue
Section 1 interpretation Section 2 company profile and main financial indicators 8 section III Management Discussion and Analysis Section IV corporate governance Section V environment, social responsibility and other corporate governance 67 section VI important matters Section VII share changes and shareholders 107 Section VIII preferred shares 118 section IX relevant information of corporate bonds 118 section x financial report one hundred and eighteen
Financial statements containing the signatures and seals of the person in charge of the company, the person in charge of accounting work and the person in charge of accounting institutions
The catalogue of documents for future reference contains the audit report sealed by the accounting firm and signed and sealed by the certified public accountant
Original copy of the company’s 2021 annual report signed by the person in charge of the company
The originals of all company documents and announcements publicly disclosed on the website designated by the CSRC during the reporting period
Section I interpretation
1、 Interpretation in this report, unless the context otherwise requires, the following words have the following meanings: Interpretation of common words
The company, the company, refers to shengmei semiconductor equipment (Shanghai) Co., Ltd
Shanghai, shengmei semiconductor
Shengmei Wuxi refers to shengmei semiconductor equipment Wuxi Co., Ltd., a wholly-owned subsidiary of shengmei Shanghai
Shengwei Shanghai refers to Shengwei semiconductor equipment (Shanghai) Co., Ltd., a wholly-owned subsidiary of shengmei Shanghai
Hong Kong Qingxin refers to cleanchip Technologies Limited, Qingxin Technology Co., Ltd. and a wholly-owned subsidiary of shengmei Shanghai
Shengmei Korea refers to ACM research Korea Co., Ltd., a wholly-owned subsidiary of Hong Kong Qingxin
Shengmei California refers to ACM Research (CA), Inc., a wholly-owned subsidiary of Hong Kong Qingxin
Shengyi technology refers to Shengyi semiconductor technology (Wuxi) Co., Ltd. and shengmei Shanghai joint stock company
Shengyi semiconductor
Hefei Shixi refers to Hefei Shixi chanheng integrated circuit venture capital fund partnership (limited partnership), a joint-stock enterprise of shengmei Shanghai
Qingdao Juyuan refers to Qingdao Juyuan Xinxing equity investment partnership (limited partnership) and shengmei Shanghai joint stock enterprise
American ACMR, ACMR refers to ACM research, Inc,
A company listed on Nasdaq stock market in the United States and the controlling shareholder of shengmei Shanghai
Changjiang storage refers to the customer of Changjiang Storage Technology Co., Ltd. and shengmei Shanghai
Semiconductor Manufacturing International Corporation(688981) refers to Semiconductor Manufacturing International Corporation(688981) , shengmei Shanghai customer
Hynix refers to sk Hynix Inc., shengmei Shanghai customer
Huahong group refers to Shanghai Huahong (Group) Co., Ltd., a customer of shengmei Shanghai
Jcet Group Co.Ltd(600584) refers to Jcet Group Co.Ltd(600584) , shengmei Shanghai customer
Tongfu Microelectronics Co.Ltd(002156) refers to Tongfu Microelectronics Co.Ltd(002156) , the customer of shengmei Shanghai
SMIC Changdian refers to SMIC Changdian semiconductor (Jiangyin) Co., Ltd., a customer of shengmei Shanghai
Nepes refers to nepes Corporation, a customer of shengmei Shanghai
Taiwan Hejing technology refers to Hejing Technology Co., Ltd., shengmei Shanghai customer
Huajin semiconductor refers to Huajin semiconductor packaging pilot technology R & D Center Co., Ltd., a customer of shengmei Shanghai
Ninebell refers to the supplier of ninebell Co., Ltd., shengmei Shanghai
DNS means screen Holdings Co., Ltd
Tel means Tokyo Electric Ltd
Lam means Lam Research Corporation
Semes means semes Co. Ltd
Naura Technology Group Co.Ltd(002371) refers to Naura Technology Group Co.Ltd(002371)
Kingsemi Co.Ltd(688037) refers to Kingsemi Co.Ltd(688037)
Pnc Process Systems Co.Ltd(603690) refers to Pnc Process Systems Co.Ltd(603690)
Advanced Micro-Fabrication Equipment Inc.China(688012) refers to Zhongwei semiconductor equipment (Shanghai) Co., Ltd
ASML means ASML holding N.V
KLA means KLA Corporation
Applied means applied materials, Inc
Materials
NASDAQ refers to the National Association of Securities Dealers Automated Quotations, the Nasdaq stock market of the United States
Semiconductors refer to materials with conductivity between conductors and insulators at room temperature. According to manufacturing technology, they can be divided into integrated circuits (IC), discrete devices, optoelectronics and sensors, which can be widely used in the next generation
Tourism communication, computer, consumer electronics, network technology, automobile, aerospace and other industries
Silicon wafers refer to silicon wafers, semiconductor grade silicon wafers, which are used in the manufacturing of integrated circuits, discrete devices, sensors and other semiconductor products
Integrated circuit refers to a circuit or system that interconnects and integrates active components such as transistors, ICs, integrated circuits, diodes and passive components such as resistors and capacitors on a semiconductor chip according to a certain circuit through a series of specific processing processes, which is encapsulated in a shell to perform specific functions
Wafers refer to silicon wafers processed in specific processes such as oxidation / diffusion, lithography, etching, ion implantation, film growth, cleaning and polishing, metallization and so on
Wafer Factory refers to the manufacturer that processes and manufactures semiconductor devices on silicon wafer through a series of specific processing processes
Chip refers to the carrier of integrated circuit, which is also the result of integrated circuit design, manufacturing, packaging and testing
Graphic wafer refers to a wafer with a pattern structure on its surface
Wafer manufacturing and chip manufacturing refers to the process of processing semiconductor silicon wafer into chip through a series of specific processing processes, which is divided into front wafer manufacturing and back packaging testing.
Memory refers to the memory device in the electronic system, which is used to store programs and data
Power devices refer to high-power electronic devices used in power conversion and control circuits of power equipment
NAND flash memory refers to flash memory / data storage flash memory
5g refers to the 5th generation, that is, the fifth generation mobile phone mobile communication standard
Lithography refers to the process technology that uses the principle of optical chemical reaction and chemical and physical etching methods to transfer circuit graphics to the surface of single crystal or dielectric layer to form effective graphics window or functional graphics
The process of selectively removing unwanted materials on the silicon surface by chemical or physical methods is a main process of etching, which refers to the graphic processing associated with lithography. It is a key step of semiconductor manufacturing process
Gluing refers to the process of evenly applying photoresist to the wafer surface
Development refers to the process of imaging the exposed wafer. Through this process, the image on the photoresist is displayed
CVD refers to chemical vapor deposition
LPCVD refers to low pressure chemical vapor deposition
ALD refers to atomic layer deposition, which is a method of plating substances on the substrate surface layer by layer in the form of monatomic film
DRAM refers to dynamic random access memory
Stress free polish, a stress-free polishing technology, uses the original SFP instruction of electrochemical reaction to abandon the mechanical pressure in the polishing process and eradicate the damage of mechanical pressure to metal wiring in the process of polishing the metal film on the wafer surface
Dielectric material means
