Company code: 688020 company abbreviation: Guangzhou Fangbang Electronics Co.Ltd(688020) Guangzhou Fangbang Electronics Co.Ltd(688020)
Annual report for 2021
Important tips
1、 The board of directors, board of supervisors, directors, supervisors and senior managers of the company guarantee the authenticity, accuracy and integrity of the contents of the annual report, and there are no false records, misleading statements or major omissions, and bear individual and joint legal liabilities. 2、 The company is not profitable and has not achieved profitability when it is listed □ yes √ no III. Major Risks suggest that the company has described in detail various risks and countermeasures that may be faced in the process of operation in this report. Please refer to section III "discussion and analysis of operation" of this report. 4、 All directors of the company attended the board meeting. 5、 Daxin Certified Public Accountants (special general partnership) issued a standard unqualified audit report for the company. 6、 Su Zhi, the person in charge of the company, Hu Gensheng, the person in charge of accounting, and Feng Binghua, the person in charge of the accounting organization (Accounting Supervisor), declare that they guarantee the authenticity, accuracy and completeness of the financial report in the annual report. 7、 The profit distribution plan or the plan of converting accumulation fund into share capital in the reporting period adopted by the resolution of the board of directors
The company's profit distribution plan for 2021 is as follows: Based on the total share capital registered on the date of equity distribution registration, the company plans to distribute a cash dividend of 1.875 yuan (including tax) to all shareholders for every 10 shares, with a total cash dividend of 15000000.00 yuan (including tax), accounting for 39.65% of the net profit attributable to shareholders of Listed Companies in the company's consolidated statements in 2021, and does not convert capital reserve into share capital, No bonus shares. The profit distribution plan of the company in 2021 has been deliberated and approved at the first meeting of the third board of directors of the company, and needs to be deliberated and approved by the 2021 annual general meeting of shareholders of the company. 8、 Whether there are important matters such as special arrangements for corporate governance □ applicable √ not applicable IX. risk statement of forward-looking statements √ applicable □ not applicable. This report involves forward-looking statements such as future plans, which does not constitute the company's substantive commitment to investors. Please pay attention to investment risks. 10、 Is there any non operational occupation of funds by the controlling shareholders and their related parties? No
11、 Whether there is any external guarantee in violation of the specified decision-making procedures? No 12. Whether more than half of the directors cannot guarantee the authenticity, accuracy and integrity of the annual report disclosed by the company? No 13. Others □ applicable √ not applicable
catalogue
Section 1 interpretation Section 2 company profile and main financial indicators Section III Management Discussion and Analysis Section IV corporate governance Section V environment, social responsibility and other corporate governance 53 section VI important matters Section VII changes in shares and shareholders 89 Section VIII preferred shares 99 section IX relevant information of corporate bonds Section x financial report one hundred
The financial report containing the signatures and seals of the legal representative of the company, the person in charge of accounting work and the person in charge of accounting organization
List of documents for future reference the text of all company documents and the original version of the announcement publicly disclosed on the website designated by the CSRC during the reporting period
Section I interpretation
1、 Interpretation in this report, unless the context otherwise requires, the following words have the following meanings: Interpretation of common words
The company, the company and Guangzhou Fangbang Electronics Co.Ltd(688020) refer to Guangzhou Fangbang Electronics Co.Ltd(688020)
Huatai United Securities refers to Huatai United Securities Co., Ltd
Daxin certified public accountants refers to Daxin Certified Public Accountants (special general partnership)
Lijia electronics refers to Guangzhou Lijia Electronics Co., Ltd
Meizhi electronics refers to Guangzhou Meizhi Electronics Co., Ltd. (limited partnership)
Meishang electronics refers to Guangzhou Meishang Electronic Technology Co., Ltd
Huangpu Feijun refers to Guangzhou Huangpu Feijun industrial investment fund partnership (limited partnership)
Jiaxing Yongyan refers to Jiaxing Yongyan equity investment partnership (limited partnership)
Xiaomi fund refers to Hubei Xiaomi Changjiang industry fund partnership (limited partnership)
Songhe venture capital refers to Suzhou Songhe growth No. 2 investment center (limited partnership)
Dachuang electronics refers to Zhuhai Dachuang Electronics Co., Ltd
Weishi electronics refers to Dongguan Weishi Electronic Material Technology Co., Ltd
Weishi electronic Qiaotou Branch refers to the Qiaotou Branch of Dongguan Weishi Electronic Material Technology Co., Ltd
Tuozida refers to tuozida electric wire Co., Ltd
Toyo Kemei means Toyo Kemei Co., Ltd
CSRC and CSRC refer to the China Securities Regulatory Commission
Shanghai stock exchange refers to Shanghai Stock Exchange
The reporting period and the current reporting period refer to the period from January 1, 2021 to December 31, 2021
Yuan and 10000 yuan refer to RMB yuan and 10000 yuan
FPC refers to flexible printed circuit board (FPC), also known as flexible circuit board or flexible circuit board. The printed circuit board made of flexible substrate has the advantage of bending and convenient assembly of electrical components
Flexibility refers to the ability of an object to maintain its shape when it is deformed by force after the force is lost
PCB refers to the printed circuit board, the substrate for assembling electronic parts. It is a printed board that forms the connection between points and printed components on the general substrate according to the predetermined design
Electromagnetic shielding film refers to the shielding body made of special materials, which limits the electromagnetic wave to a certain range and suppresses or attenuates its electromagnetic radiation.
At present, it is a new type of electromagnetic shielding film, which has been widely used in smart phones and other electronic products
Conductive adhesive film refers to an adhesive with certain conductivity after curing or drying. It usually takes matrix resin and conductive particles as the main components, and combines the conductive particles through the bonding action of matrix resin, A conductive path is formed to realize the conductive connection of the bonded material
Flexible copper clad laminate and FCCL finger copper clad laminate are made of reinforcing material, impregnated with resin adhesive, dried, cut and stacked to form blank, then covered with copper foil and steel sector as mold, It is made by high temperature and high pressure forming in a hot press. FCCL is the processing substrate of FPC and COF (flexible substrate with chip) flexible packaging substrate, which can be divided into two categories according to structure: traditional adhesive
Three layer flexible copper clad laminate (3l-fccl) and new adhesive free two-layer flexible copper clad laminate (2L-FCCL)
Ultra thin copper foil generally refers to the thickness of 9 μ The copper foil below M can be used to prepare peelable ultra-thin copper foil with carrier, lithium battery copper foil, ordinary flexible sector copper foil, etc
Resistance film refers to resistance film, also known as embedded resistance and buried resistance. It is through the introduction of resistance layer between copper foil and substrate of printed circuit board, and then through spray etching metal and other processes, Exposing the resistance layer as a resistor on the printed circuit board can reduce the area occupied by independent passive components (resistive, capacitive and inductive components) on the printed circuit board, Better meet the current high-density demand of printed circuit boards and the trend of "light, thin and short" of electronic products.
Release film refers to the film whose surface can be distinguished. The release film has no viscosity or slight viscosity after contacting with specific materials under limited conditions
Grounding resistance refers to the resistance encountered by the current flowing into the earth from the grounding device and then flowing through the earth to another grounding body or spreading to a distance
Peel strength refers to the maximum force required for the material pasted together to peel per unit width from the contact surface
Insertion loss refers to the signal loss caused by inserting cables or components between transmitter and receiver, usually refers to attenuation
3l-fccl refers to three-layer flexible copper clad laminate, which is composed of copper foil, base film and adhesive
