5g has given birth to the interconnection of all things. New applications contain unlimited business opportunities, which also brings important opportunities to the third generation semiconductor.
On the 29th, trendforce Jibang consulting held the third generation semiconductor online exchange meeting. Leading enterprises such as innoseco, Tyco Tianrun and Yiwen technology disclosed the latest progress of their industrialization.
Participants believed that third generation semiconductor is favored by the capital market, and the industry has entered a period of rapid growth. It is expected that China’s compound semiconductor industry is expected to rise in the next five years
favored by capital
On April 27, the official website of Shanghai Stock Exchange showed that the IPO of Nanjing Jingsheng Equipment Co., Ltd. (hereinafter referred to as “Jingsheng equipment”) science and innovation board has been accepted.
It is reported that Jingsheng equipment is a supplier of special semiconductor equipment, mainly providing customized crystal growth equipment such as semiconductor grade monocrystalline silicon furnace, silicon carbide monocrystalline furnace and sapphire monocrystalline furnace. Among them, silicon carbide single crystal furnace is mainly used in the manufacturing of silicon carbide single crystal substrate, and sapphire single crystal furnace is mainly used in the manufacturing of LED substrate and materials in the field of consumer electronics. In 2021, silicon carbide single crystal furnace accounted for 63.81% of its revenue. In recent three years, Jingsheng equipment has successively developed Sanan Optoelectronics Co.Ltd(600703) , Zhejiang Tony Electronic Co.Ltd(603595) , Zhejiang Jingyue and other customers.
In September 2021, the last round of financing before the company’s IPO application, industry leaders National Silicon Industry Group Co.Ltd(688126) , Advanced Micro-Fabrication Equipment Inc.China(688012) , Hangzhou Lion Electronics Co.Ltd(605358) and other hot lines caught up with the last train.
Gong ruijiao, an analyst at global science and Technology Research Institute Jibang consulting compound semiconductor, revealed that at present, the third generation semiconductor is favored by the capital market. In the past two years, many manufacturers have obtained financing. Overseas companies such as wolfspeed, Navitas and transphorm have been listed. China, such as Shandong Tianyue, successfully landed on the science and innovation board this year, Tianke Heda and others are also preparing for IPO. The financing of Tyco Tianrun, innoseco and other primary markets is also quite smooth, Tongguang crystal financing is also supported by Great Wall Motor Company Limited(601633) , Shenzhen Inovance Technology Co.Ltd(300124) .
The third generation semiconductor is a wide band gap semiconductor material represented by gallium nitride and silicon carbide. The improvement of device performance of the first and second generation semiconductor technologies in the fields of optoelectronics, power electronics, RF and microwave has approached the physical limit of materials. There is an urgent need to develop the third generation semiconductor technology. In terms of performance, silicon carbide is more suitable for some high-power scenes, such as UHV, rail transit, photovoltaic, new energy vehicles, etc. Gallium nitride is more suitable for some high-frequency scenes, such as communication base stations and data centers.
Gong ruijiao, an analyst at Jibang consulting, said that China has been vigorously promoting new infrastructure in recent years, including 5g base stations, rail transit, new energy vehicles, data centers and renewable energy, which will greatly boost the demand for third-generation semiconductors. The global silicon carbide and gallium nitride power semiconductor market is expected to reach US $1.84 billion in 2022 and further grow to US $5.29 billion in 2025.
Chinese enterprise overweight third generation semiconductor
In 2021, “lack of core” is the key word of the whole Chinese automobile industry. Chinese enterprises are making every effort to promote the industrialization of third-generation semiconductors.
Jibang consulting research shows that from the application market in 2022, 67% of silicon carbide materials are used in automobiles, 26% in industry, and the rest are used in consumption and other fields. 70% of gallium nitride materials are used in consumer electronics fields such as fast charging, 23% in industry and 4% in automobiles.
Tyco Tianrun is China’s first silicon carbide electronic power enterprise certified by DNV and USCG. Tyco Tianrun Hunan 6-inch silicon carbide expansion project has entered the trial production stage in July last year, with more than 40 engineering batches and a comprehensive yield of more than 90%. The relevant person of the company told the reporter of Shanghai Securities News that the full production of the company’s Hunan production line is 60000 pieces / year. Last year, it has realized batch shipment, and the order has exceeded 100 million yuan in April this year.
innoseco built the world’s first 8-inch silicon-based gallium nitride IDM mass production line, which has been shipped on a large scale. The company plans to invest 6 billion yuan to expand the Suzhou 8-inch gallium nitride R & D and production base, which will form an annual production capacity of 780000 power control circuits and semiconductor power electronic devices.
Innosecco has carried out in-depth cooperation with Huawei, Inspur, Xiaomi, oppo, Dajiang, Byd Company Limited(002594) , Hesai technology, Ansenmei, MPs and other Chinese and foreign manufacturers to develop the application of power devices and RF devices.
Hunan San’an Semiconductor Co., Ltd., a subsidiary of Sanan Optoelectronics Co.Ltd(600703) is mainly engaged in R & D and industrialization of silicon carbide and silicon-based gallium nitride, including long crystal substrate fabrication epitaxial growth chip preparation packaging industrial chain, with a total investment of 16 billion yuan. After the project is completed, a production capacity of about 360000 tablets / year will be formed. The first phase of the project is under construction, and the built capacity is expected to reach full capacity by July 2022. It is expected to initially release 3000 pieces / month of silicon carbide and 1000 pieces / month of silicon-based gallium nitride.
The construction of compound semiconductor is in full swing, which also helps China’s equipment take off Yiwen technology is a new R & D manufacturer of thin film and etching equipment in this field, with a sales revenue of 320 million yuan last year. Ye Guoguang, deputy general manager of the company, predicts that China has a very large market, many overseas talents slowly return to China, the capital market is also supporting the localization of equipment, and the joint efforts of talent, market, capital and policy are expected to rise in China’s compound semiconductor industry in the next five years.
