Shenzhen Hongtao Group Co.Ltd(002325) 4 disclosed the announcement on the repayment of non-public corporate bonds on schedule. The announcement shows that as of the date of this announcement, the company has completed the repayment of all funds of “19 Hongtao 01” non-public issuance of corporate bonds, and the total principal and interest expenses of “19 Hongtao 01” corporate bonds are 213.6 million yuan. After the completion of this cashing and interest exchange, “19 Hongtao 01” corporate bonds will be delisted in Shenzhen Stock Exchange. The company successfully issued 2019 non-public corporate bonds (phase I) on April 24, 2019. The bonds are referred to as “19 Hongtao 01”, the bond code is 114469, and the maturity date of the bonds is April 25, 2022. The actual funds raised by the bonds are 200 million yuan, and the coupon rate of the bonds is 6.8%. The principal and interest of the bond shall be paid once a year, and the principal shall be paid once at maturity, and the last interest shall be paid together with the payment of the principal.