Every AI express, investors ask questions on the investor interaction platform: Hello, brother bin, the new year is coming. I wish Sai Microelectronics Inc(300456) all my colleagues a happy new year. I want to know what the advantages of the company’s packaging business are, because the three steps of design, manufacturing and packaging still account for a high proportion of packaging value. The company now does both manufacturing and packaging. However, the company seems to have no experience in packaging related business, so how to win customers’ packaging orders? In addition, a recent article mentioned that the original MEMS law is three “ones”, product, process and packaging. Now MEMS manufacturing is compatible with standard COMS and simplifies the process. Is the company also promoting this? thank you
Sai Microelectronics Inc(300456) (300456. SZ) said on the investor interaction platform on December 31 that the biggest strength and advantage of the company’s layout of MEMS packaging and testing lies in the company’s existing MEMS manufacturing business. There is a strong stickiness between customers and the company, there is an objective demand for manufacturing and packaging integration, and wafer level packaging and testing can greatly improve efficiency, The company’s goal is to provide customers with one-stop services from process development to wafer manufacturing to packaging and testing; MEMS and standard CMOS compatibility requirements and trends are taking place, and the company pays close attention to them.
(Daily Economic News)
