On December 25, according to business Korea, a Korean media, Samsung electric announced on December 23 that it had decided to invest US $850 million (about 1.1 trillion won) in its Vietnamese subsidiary to build flip chip ball grid array (fc-bga) production equipment and infrastructure.
Samsung electric plans to inject investment funds in phases from now to 2023, in which the Vietnamese factory is the main production base, while the factories in Suwon City, Gyeonggi province and Busan City, South Korea will focus on the development of core technologies.
It is understood that flip chip ball grid array is the connecting material for transmitting electrical signals and power between semiconductor chip and motherboard. It is one of the most difficult products to manufacture in semiconductor packaging substrate.
(interface News)
