After AI express, investors ask questions on the investor interaction platform: it is reported that the multi wire cutting machine and grinding and polishing machine produced by the company are used for the processing of a variety of hard and brittle materials, such as sapphire, single crystal / polycrystalline silicon and silicon carbide. They are widely used in the substrate materials of semiconductor devices, mainly for the production of semiconductor components such as LED, IGBT and IC. Is it true?
Hunan Yujing Machinery Co.Ltd(002943) (002943. SZ) said on the investor interaction platform on February 19 that the multi wire cutting machine produced by the company is mainly used for cutting and processing sapphire, single crystal / polysilicon and magnetic materials.
