Market overview of this week:
This week, Shenwan semiconductor industry index fell by – 0.99%, the gem index fell by 2.72% in the same period, the Shanghai Composite Index rose by 0.04%, the Shenzhen composite index fell by 0.85%, the small and medium-sized board index rose by 0.05%, and wandequan a fell by 1.03%. The semiconductor industry index generally underperformed the main indexes. Semiconductor segments fell as a whole. Among the semiconductor segments, the semiconductor material segment fell by 4.6%, the discrete device segment fell by 1.5%, the semiconductor equipment segment fell by 2.5%, the semiconductor manufacturing segment fell by 1.9%, the IC Design segment fell by 1.4%, the packaging and testing segment fell by 2.1% and other segments fell by 5.6% this week.
Key points of CES exhibition in the United States: new products of autopilot, intelligent cockpit and lidar appear together
In terms of automatic driving, Intel subsidiary Mobileye launched eyeq ultra, NVIDIA released the eighth generation drive Hyperion automatic driving platform, NVIDIA drive Orin chip computing power up to 254tops, and anba launched a new AI domain controller chip CV3 series. In terms of smart cockpit, Qualcomm launched the 4th generation Xiaolong smart cockpit platform, BMW launched BMW suspended giant screen, Sony launched vison-s 02, equipped with through dashboard and in car entertainment system. In terms of lidar, Hesai Technology launched the vehicle specification level semi-solid lidar at128 and the new short-range ultra wide-angle lidar qt128 equipped with a new generation of self-developed chips. Suteng juchuang released the world’s only solid-state lidar rs-lidar-m1 and Valeo’s third-generation Scala lidar.
The proportion of TSMC’s automobile business increased significantly, with a year-on-year increase of + 51% in 21 years, becoming the fastest growing business
TSMC’s automotive and HPC end businesses increased significantly in 2021, with revenue increasing by 51% and 34% year-on-year respectively. The output of MCU, a key component of automotive chip, increased by 60% compared with 2020 and 30% compared with the level before the pandemic in 2019. TSMC stressed that the company will continue to cooperate with the automotive supply chain to solve the current chip shortage.
Chinese semiconductor enterprises include master control / storage / sensing / power, and actively layout automotive electronics
In terms of main chip manufacturers, Jingchen has made positive progress in cooperation with overseas high-end high-value customers and received some customer orders; Rockchip Electronics Co.Ltd(603893) PX series products have been applied to some automotive electronic products, and launched the first chip rk3358m that has passed the aec-q100 automotive reliability standard test, Shanghai Fullhan Microelectronics Co.Ltd(300613) focuses on the layout of on-board vision chip, has passed the aecq100grade2 certification, and has entered the automotive front loading market. In terms of storage / sensor manufacturers, Will Semiconductor Co.Ltd.Shanghai(603501) CMOS image sensors, LCOS and ASIC can be used in the automotive field. Ingenic Semiconductor Co.Ltd(300223) entered the field of on-board memory chips and reached close cooperation with downstream automobile enterprises such as Bosch automobile and continental group. Gigadevice Semiconductor (Beijing) Inc(603986) gd25spinorflash fully meets the vehicle specification level aec-q100 certification, and has adopted power semiconductors in batches in many automobile enterprises. The main motor drive modules of electric vehicles with Hangzhou Silan Microelectronics Co.Ltd(600460) generation V IGBT and FRD chips have been supplied in batches to some customers; Zhuzhou Crrc Times Electric Co.Ltd(688187) obtain orders from GAC and Dongfeng; Starpower Semiconductor Ltd(603290) in the first half of 2021, more than 200000 new energy vehicles will be equipped with vehicle specification level IGBT modules; Macmic Science & Technology Co.Ltd(688711) GV series products of vehicle gauge IGBT module have been supplied in small quantities.
It is recommended to pay attention to:
1) semiconductor design: Amlogic (Shanghai) Co.Ltd(688099) / Rockchip Electronics Co.Ltd(603893) / Shanghai Fullhan Microelectronics Co.Ltd(300613) / Will Semiconductor Co.Ltd.Shanghai(603501) / Sg Micro Corp(300661) / 3Peak Incorporated(688536) / Montage Technology Co.Ltd(688008) / Sino Wealth Electronic Ltd(300327) / Bestechnic (Shanghai) Co.Ltd(688608) / Espressif Systems (Shanghai) Co.Ltd(688018) / Starpower Semiconductor Ltd(603290) / Macmic Science & Technology Co.Ltd(688711) / Wuxi Nce Power Co.Ltd(605111) / Allwinnertech Technology Co.Ltd(300458) / Gigadevice Semiconductor (Beijing) Inc(603986) / Maxscend Microelectronics Company Limited(300782) / Shanghai Bright Power Semiconductor Co.Ltd(688368) / Unigroup Guoxin Microelectronics Co.Ltd(002049) / Shanghai Fudan
\u3000\u30002）IDM: Wingtech Technology Co.Ltd(600745) / Sanan Optoelectronics Co.Ltd(600703) / Zhuzhou Crrc Times Electric Co.Ltd(688187) / Hangzhou Silan Microelectronics Co.Ltd(600460) ；
3) wafer foundry: Semiconductor Manufacturing International Corporation(688981) / Huahong semiconductor;
4) semiconductor equipment materials: Naura Technology Group Co.Ltd(002371) / Jiangsu Yoke Technology Co.Ltd(002409) / Shanghai Sinyang Semiconductor Materials Co.Ltd(300236) / Advanced Micro-Fabrication Equipment Inc.China(688012) / Wuhan Jingce Electronic Group Co.Ltd(300567) / Beijing Huafeng Test & Control Technology Co.Ltd(688200) / Hangzhou Chang Chuan Technology Co.Ltd(300604) / Grinm Advanced Materials Co.Ltd(600206) / Jiangyin Jianghua Microelectronics Materials Co.Ltd(603078) ;
Risk warning: the epidemic situation continues to deteriorate; The impact of trade war; The demand is less than expected
