Semiconductors: liandian entered the field of gallium nitride, and Hanlei, a wafer manufacturer, expanded the production of third-generation semiconductors
Liandian investment Lianying has officially entered gallium nitride and may lay out silicon carbide in the future. According to DIGITIMES, liandian has entered the third generation semiconductor field by investing in Lianying. It plans to start with 6-inch gallium nitride Gan products, lay out silicon carbide SiC and develop to 8-inch wafers. Liandian said that since few manufacturers in the industry can provide Gan overall solutions, it is building a technical platform, which is jointly developed by liandian and Lianying, focusing on applications such as electronics, RF and microwave. It is expected to be introduced to IC design customers next year. At the same time, Lianying is expected to become the main production position of liandian’s third-generation semiconductor. Previously, Lianying’s main business was 6-inch wafers, but it was in a state of loss for a long time, and the capacity utilization rate was also at a low level. However, since the second half of last year, the performance has improved, the production capacity has been continuously full, and the production capacity next year is expected to double that of this year. In addition, liandian has joined hands with the Belgian Microelectronics Research Center (IMEC), which is known as a world-renowned independent public R & D platform and an indicator R & D institution in the semiconductor industry, to carry out the R & D of the third generation of semiconductors.
Hanlei accelerates the construction of production capacity, or will enter the 8-inch silicon carbide SiC process. In June this year, Taiwan wafer manufacturer Han Lei and its subsidiary Jiajing began to accelerate the construction of production capacity in the field of SiC and Gan, aiming at the market demand for third-generation semiconductors. 6-inch SiC wafers are in the trial production stage, and the client has the greatest demand for electric vehicles. At present, its monthly production capacity of 6-inch SiC and Gan is about 1000 pieces respectively. Next year, the SiC production capacity will be greatly increased, and the monthly production capacity of Gan will also be expanded to 2000 pieces. Due to the full capacity of 6-inch SiC and Gan, Han Lei said for the first time that it would enter the 8-inch SiC process. It is expected that the cost of 8-inch SiC substrate will be greatly reduced by 20-30%, further expand the operation kinetic energy and gradually improve the profitability. With the global SiC chip leading plant Wolfspeed expanding, the related capacity will increase by 30 times. Many manufacturers in Taiwan and China Chinese mainland join the third generation semiconductor.
We believe that with the rise of downstream 5g, electric vehicles and other fields, the demand for high frequency, high voltage, low power consumption and fast charging has increased significantly. The first and second generation semiconductor materials have reached the physical limit in temperature, power and other characteristics, and the third generation semiconductor materials came into being. The third generation semiconductor materials based on silicon carbide and gallium nitride can better achieve high efficiency and low power consumption. It is expected to realize large-scale application in the future, and the market space is broad. Among Chinese enterprises, major manufacturers have gradually started the layout of third-generation semiconductors, which is expected to fully benefit from the demand driven by the downstream market in the future. At present, among the world’s mainstream manufacturers, 4-inch and 6-inch are the mainstream processes of the third-generation semiconductor, and there are still restrictions on the development of the 8-inch process. After solving the technical and cost problems in the future, the third-generation semiconductor may achieve a breakthrough in the 8-inch wafer.
Consumer electronics: Xiaomi 12 series benchmarked apple, and Samsung’s shipments of folding screen mobile phones may reach 13 million in 2022
Samsung raised the shipment target of folding screen mobile phones to 13 million units in 2022. According to digtimesresearch, the shipment target of Samsung folding screen mobile phones will be increased to 13 million units in 2022. In order to cooperate with Samsung Electronics to increase the shipment of high-end folding screen smartphones in 2022, Samsung display SDC plans to increase the shipment of folding OLED panels to 18 million pieces. This year, the sales volume of Samsung Galaxy Z series folding screen smartphones is four times that of last year. Driven by the two popular models of galaxy zfold3 and galaxy zflip3 among young consumers, the total sales volume of Samsung Galaxy Z series phones this year is estimated to be about 8-9 million. According to counterpoint research, this year’s foldable screen smartphone market will triple that of 2020, while Samsung will dominate the market with 75% market share by 2023.
Xiaomi 12 was officially released and officially benchmarked with apple. Xiaomi has invested more than 100 billion yuan in R & D in the next five years. Xiaomi 12 was officially released at a price of 3699 yuan. Its positioning is to make the flagship experience a small-size high-end flagship in a small-size fuselage. The fuselage less than 7cm wide brings a sense of one hand gold grip, lightness and control. Compared with the previous generation, it has carried out six comprehensive upgrades: upgrading the processor Xiaolong 8 flagship platform, Sony imx7665 million pixel main camera, 32 million pixel selfie, 2600mm2vc heat dissipation, 67W wired + 50W wireless fast charging, Harman Caton symmetrical stereo; The world’s first exclusive customized 12bit color depth 6.28 inch 120Hz high brush screen has been certified by displaymatea +. Equipped with Xiaolong 8gen1 processor and self-developed cyberfocus all things focusing technology. The world’s first self-developed Xiaomi surging P1 charging chip realizes the industry’s first high-capacity single cell 120W safe and fast charging; The digital series is the world’s first four unit flagship speaker, with a total of five new breakthroughs in pro level technology. Xiaomi’s Small-size flagship mobile phone Xiaomi 12x has the same hardware configuration as Xiaomi 12 except for switching to Xiaolong 870 platform and canceling wireless charging function. Lei Jun, founder, chairman and CEO of the group, said that Xiaomi will invest 100 billion R & D funds in the next five years and officially benchmark apple in product strategy.
We believe that the smartphone market has entered the era of stock game. The release of Xiaomi 12 series is officially benchmarked with apple. The high R & D investment of 100 billion in five years is expected to drive the continuous breakthrough of self-developed technology of Xiaomi products, or change the current smartphone market pattern, and Xiaomi industrial chain enterprises may benefit. At the same time, the rise of the folding screen mobile phone market may enhance the ceiling of the smart phone market. Samsung, the leader of the folding screen mobile phone market, improves the shipping target of folding screen smart phones in 2022, which is expected to drive the further growth of the folding screen mobile phone market. Chinese enterprises have certain market competitiveness in the folding screen mobile phone links such as panels, cover materials and hinges, It is expected to fully benefit from the rapid growth of folding screen mobile phone market in the next few years.
Risk statement
The downstream demand of semiconductor is less than expected, and the folding screen is less than expected.
Related subject matter
Semiconductor design: [ Will Semiconductor Co.Ltd.Shanghai(603501) ] [ Allwinnertech Technology Co.Ltd(300458) ] [ Gigadevice Semiconductor (Beijing) Inc(603986) ] [ Sg Micro Corp(300661) ] [ Maxscend Microelectronics Company Limited(300782) ] [ Chipsea Technologies (Shenzhen) Corp.Ltd(688595) ]; Wafer Foundry: [ Semiconductor Manufacturing International Corporation(688981) ] [Huahong semiconductor]; Semiconductor material: [ Red Avenue New Materials Group Co.Ltd(603650) ] [Jingrui Co., Ltd.]; Power semiconductor: [ Wingtech Technology Co.Ltd(600745) ] [ China Resources Microelectronics Limited(688396) ] [ Hangzhou Silan Microelectronics Co.Ltd(600460) ] [ Starpower Semiconductor Ltd(603290) ] [ Wuxi Nce Power Co.Ltd(605111) ]
Consumer electronics: [ Goertek Inc(002241) ] [ Sunwoda Electronic Co.Ltd(300207) ] [ Avary Holding (Shenzhen) Co.Limited(002938) ] [ Luxshare Precision Industry Co.Ltd(002475) ]; Smartphone: [Xiaomi group]
Panel: [BOE] [shentianma] folding screen: [ Jiangsu Gian Technology Co.Ltd(300709) ] [ Wuhu Token Sciences Co.Ltd(300088) ]
